公开(公告)号：US20200312748A1

公开(公告)日：2020-10-01

申请号：US16504929

申请日：2019-07-08

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hiroshi INOGUCHI ,  Isao OCHIAI ,  Takayuki TAGUCHI

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

Abstract: Leadframe systems and related methods. Specific implementations of leadframe systems may include a die pad, a semiconductor die coupled to the die pad, where the semiconductor die has a perimeter. A leadframe may be coupled over the die pad and the semiconductor die where the leadframe has a solder dam coupled around the semiconductor die and, the solder dam has a perimeter that corresponds with the semiconductor die The die pad may have no groove adjacent to the semiconductor die.

公开(公告)号：US20170077061A1

公开(公告)日：2017-03-16

申请号：US15135973

申请日：2016-04-22

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Nobuhisa ONAI ,  Takayuki TAGUCHI

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/233 ,  B23K20/2333 ,  B23K37/0443 ,  B23K2101/42 ,  B25B11/005 ,  H01L24/85 ,  H01L2224/78744 ,  H01L2224/78842 ,  H01L2224/78983 ,  H01L2224/8515 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

Abstract translation: 本技术的各种实施例可以包括用于改进粘合的方法和装置，并且可以与构造成支撑衬底的主平台结合操作。 当可旋转的构件旋转到第一位置时，可移动构件可以允许衬底定位在主平台上，并且当旋转到第二位置时，将衬垫施加到衬底的面向上的表面上的预定区域上。