公开(公告)号：US20190221493A1

公开(公告)日：2019-07-18

申请号：US15874355

申请日：2018-01-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  HuiBin CHEN ,  Keunhyuk LEE ,  Jerome TEYSSEYRE

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/18 ,  H01L25/11 ,  H01L25/00

Abstract: In one general aspect, a package can include a first submodule including a first semiconductor die coupled to a first substrate and a first spacer, and disposed between the first spacer and the first substrate. The first submodule includes a second spacer disposed lateral to the first semiconductor die. The package includes a second submodule including a second semiconductor die coupled to a second substrate and a third spacer, and disposed between the third spacer and the second substrate. The second submodule includes a fourth spacer disposed lateral to the second semiconductor die. The package includes an inter-module layer disposed between the first submodule and the second submodule. The first spacer of the first submodule is electrically coupled to the fourth spacer of the second-submodule via the inter-module layer. The second spacer of the first submodule is electrically coupled to the third spacer of the second-submodule via the inter-module layer.