公开(公告)号：US11816405B2

公开(公告)日：2023-11-14

申请号：US17930081

申请日：2022-09-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph Victory ,  Klaus Neumaier ,  YunPeng Xiao ,  Jonathan Harper ,  Vaclav Valenta ,  Stanley Benczkowski ,  Thierry Bordignon ,  Wai Lun Chu

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F119/08 ,  G06F111/02 ,  G06F117/12

CPC classification number: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F2111/02 ,  G06F2117/12 ,  G06F2119/08

Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.

公开(公告)号：US11481533B2

公开(公告)日：2022-10-25

申请号：US17076072

申请日：2020-10-21

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph Victory ,  Klaus Neumaier ,  YunPeng Xiao ,  Jonathan Harper ,  Vaclav Valenta ,  Stanley Benczkowski ,  Thierry Bordignon ,  Wai Lun Chu

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F119/08 ,  G06F111/02 ,  G06F117/12

Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.

公开(公告)号：US12169670B2

公开(公告)日：2024-12-17

申请号：US18479179

申请日：2023-10-02

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph Victory ,  Klaus Neumaier ,  YunPeng Xiao ,  Jonathan Harper ,  Vaclav Valenta ,  Stanley Benczkowski ,  Thierry Bordignon ,  Wai Lun Chu

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F111/02 ,  G06F117/12 ,  G06F119/08

Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.