公开(公告)号：US20250081647A1

公开(公告)日：2025-03-06

申请号：US18462082

申请日：2023-09-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG ,  Kai Chat TAN ,  May May GAN

IPC: H01L27/146 ,  H01L23/00

Abstract: Implementations of an image sensor package may include an optically transmissive cover including a groove along an entire perimeter of the optically transmissive cover; an image sensor die; an adhesive material coupling the optically transmissive cover to the image sensor die; and a mold compound contacting sidewalls of the image sensor die, contacting the adhesive material, and extending into the groove.