公开(公告)号：US20250081647A1

公开(公告)日：2025-03-06

申请号：US18462082

申请日：2023-09-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG ,  Kai Chat TAN ,  May May GAN

IPC: H01L27/146 ,  H01L23/00

Abstract: Implementations of an image sensor package may include an optically transmissive cover including a groove along an entire perimeter of the optically transmissive cover; an image sensor die; an adhesive material coupling the optically transmissive cover to the image sensor die; and a mold compound contacting sidewalls of the image sensor die, contacting the adhesive material, and extending into the groove.

公开(公告)号：US20190122963A1

公开(公告)日：2019-04-25

申请号：US16031948

申请日：2018-07-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Sw WANG ,  Kai Chat TAN

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: Implementations of a semiconductor package may include a first side of a die coupled to a first side of an electrically insulative layer, a second side of the electrically insulative layer coupled to a lead frame, and at least one ground stud physically coupled to the lead frame and to the die, the at least one ground stud extending from the second side of the electrically insulative layer into the electrically insulative layer from the lead frame. The die may be wire bonded to the lead frame.