公开(公告)号：US20200035586A1

公开(公告)日：2020-01-30

申请号：US16045275

申请日：2018-07-25

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jin Yoong LIONG ,  Soon Wei WANG ,  How Kiat LIEW

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: In a general aspect, a chip-on-lead semiconductor device package can include a leadframe having a plurality of signal leads. The plurality of signal leads can include at least two signal leads each having a first face with a first surface area and, opposite the first face, a second face with a second surface area, the second faces of the at least two signal leads being exposed on a surface of the chip-on-lead device package. The plurality of signal lead can also include at least one signal lead having a first face with a third surface area and, opposite the first face of the at least one signal lead, a second face with the second surface area, the second face of the at least one signal lead being exposed on the surface of the chip-on-lead semiconductor device package.

公开(公告)号：US20240332135A1

公开(公告)日：2024-10-03

申请号：US18193847

申请日：2023-03-31

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/4952 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/4951 ,  H01L23/49565 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/181

Abstract: Implementations of methods of forming semiconductor packages may include coupling a plurality of die to a pad carrier that includes a carrier and a plurality of pads, wire bonding the plurality of die to the plurality of pads, applying a mold compound over the plurality of die, removing the carrier, and singulating a plurality of semiconductor packages.

公开(公告)号：US20250081647A1

公开(公告)日：2025-03-06

申请号：US18462082

申请日：2023-09-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG ,  Kai Chat TAN ,  May May GAN

IPC: H01L27/146 ,  H01L23/00

Abstract: Implementations of an image sensor package may include an optically transmissive cover including a groove along an entire perimeter of the optically transmissive cover; an image sensor die; an adhesive material coupling the optically transmissive cover to the image sensor die; and a mold compound contacting sidewalls of the image sensor die, contacting the adhesive material, and extending into the groove.

公开(公告)号：US20190067143A1

公开(公告)日：2019-02-28

申请号：US15812591

申请日：2017-11-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG ,  Chee Hiong CHEW ,  Francis J. CARNEY

IPC: H01L23/31 ,  H01L23/492 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L21/78 ,  H01L21/56 ,  H01L21/3105

CPC classification number: H01L23/3114 ,  H01L21/31053 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/32 ,  H01L24/73 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/1203 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2924/1816 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2924/014

Abstract: In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.