公开(公告)号：US20220181192A1

公开(公告)日：2022-06-09

申请号：US17652877

申请日：2022-02-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Takashi NOMA ,  Noboru OKUBO ,  Yusheng LIN

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L29/739 ,  H01L29/861

Abstract: At least one circuit element may be formed on a front side of a ringed substrate, and the ringed substrate may be mounted on a mounting chuck. The mounting chuck may have an inner raised portion configured to receive the thinned portion of the substrate thereon, and a recessed ring around a perimeter of the mounting chuck configured to receive the outer ring of the ringed substrate therein. At least one solder bump may be formed that is electrically connected to the at least one circuit element, while the ringed wafer is disposed on the mounting chuck.

公开(公告)号：US20210028051A1

公开(公告)日：2021-01-28

申请号：US16661686

申请日：2019-10-23

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Takashi NOMA ,  Noboru OKUBO ,  Yusheng LIN

IPC: H01L21/687 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L29/861 ,  H01L29/739

Abstract: At least one circuit element may be formed on a front side of a ringed substrate, and the ringed substrate may be mounted on a mounting chuck. The mounting chuck may have an inner raised portion configured to receive the thinned portion of the substrate thereon, and a recessed ring around a perimeter of the mounting chuck configured to receive the outer ring of the ringed substrate therein. At least one solder bump may be formed that is electrically connected to the at least one circuit element, while the ringed wafer is disposed on the mounting chuck.