公开(公告)号：US20190326202A1

公开(公告)日：2019-10-24

申请号：US16459954

申请日：2019-07-02

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Roger M. ARBUTHNOT ,  Stephen ST. GERMAIN

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/492 ,  H01L21/56

Abstract: Various leadframe implementations may include a conductive substrate electrically coupled to a first lead where the conductive substrate includes a first elevated region and a second elevated region on a first side of the conductive substrate. The first elevated region may include a first planar surface and the second elevated region may include a second planar surface on the first side of the conductive substrate. Various implementations may include where the first planar surface of the first elevated region and the second planar surface of the second elevated region are configured to attach to a contact pad of a semiconductor die. The first planar surface may include a curved edge. The second planar surface may include a polygonal shape. The curved edge of the first planar surface may be configured to laterally align with a curved edge of the contact pad of the semiconductor die.

公开(公告)号：US20170110391A1

公开(公告)日：2017-04-20

申请号：US15391960

申请日：2016-12-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen ST. GERMAIN ,  Roger M. ARBUTHNOT ,  Jay A. YODER ,  Dennis Lee CONNER

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49805 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on an opposing side of the die from the first face of the die. The at least one clip may include at least one lead in electrical communication with the at least one electrical contact on the second face of the die. A mold compound or an encapsulating compound may be included around the die and a majority of the at least one clip where a portion of the at least one lead and a portion of the plurality of electrical contacts on the first face of the die are not overmolded or encapsulated. The semiconductor package includes no lead frame.