公开(公告)号：US20220059443A1

公开(公告)日：2022-02-24

申请号：US17453623

申请日：2021-11-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome TEYSSEYRE ,  Romel MANATAD ,  Chung-Lin WU ,  Bigildis DOSDOS ,  Erwin Ian ALMAGRO ,  Maria Cristina ESTACIO

IPC: H01L23/498 ,  H01L23/495

Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.