公开(公告)号：US20220059443A1

公开(公告)日：2022-02-24

申请号：US17453623

申请日：2021-11-04

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Jerome TEYSSEYRE ,  Romel MANATAD ,  Chung-Lin WU ,  Bigildis DOSDOS ,  Erwin Ian ALMAGRO ,  Maria Cristina ESTACIO

IPC分类号： H01L23/498 ,  H01L23/495

摘要： In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

公开(公告)号：US20210111106A1

公开(公告)日：2021-04-15

申请号：US16675525

申请日：2019-11-06

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Jeffrey Peter GAMBINO ,  David T. Price ,  Jeffery A. NEULS ,  Dean E. PROBST ,  Santosh MENON ,  Peter A. BURKE ,  Bigildis DOSDOS

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L25/11 ,  H01L25/00

摘要： A stacked assembly of semiconductor devices includes a mounting pad covering a first portion of a low-side semiconductor device, and a contact layer covering a second portion of the low-side semiconductor device. A first mounting clip electrically connected to the contact layer has a supporting portion joining the first mounting clip to a first lead frame portion. A second mounting clip attached to the mounting pad has a supporting portion joining the second mounting clip to a second lead frame portion. A high-side semiconductor device has a first terminal electrically connected to the first mounting clip and thereby to the contact layer, and a second terminal electrically connected to the second mounting clip.

公开(公告)号：US20220238421A1

公开(公告)日：2022-07-28

申请号：US17248382

申请日：2021-01-22

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Maria Clemens Ypil QUINONES ,  Bigildis DOSDOS ,  Jerome TEYSSEYRE ,  Erwin Ian Vamenta ALMAGRO ,  Romel N. MANATAD

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

摘要： A semiconductor device package may include a leadframe having a first portion with first extended portions and a second portion with second extended portions. Mold material may encapsulate a portion of the leadframe and a portion of a semiconductor die mounted to the leadframe. A first set of contacts of the semiconductor die may be connected to a first surface of the first extended portions, while a second set of contacts may be connected to a first surface of the second extended portions. A mold-locking cavity having the mold material included therein may be disposed in contact with a second surface of the first extended portions opposed to the first surface of the first extended portions, a second surface of the second extended portions opposed to the first surface of the second extended portions, the first portion of the leadframe, and the second portion of the leadframe.