公开(公告)号：US20170084687A1

公开(公告)日：2017-03-23

申请号：US15252009

申请日：2016-08-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Gordon M. GRIVNA ,  Steve M. ETTER ,  Hiroyuki SUZUKI ,  Miki ICHIYANAGI ,  Toshihiro HACHIYANAGI

IPC: H01L29/06 ,  H01L21/762

CPC classification number: H01L29/0649 ,  H01L21/76232 ,  H01L28/10 ,  H01L29/0692 ,  H01L29/401 ,  H01L29/407 ,  H01L29/408 ,  H01L29/7811 ,  H01L29/7813

Abstract: An electronic device can include a substrate and an insulating structure. In an aspect, an anchor can include a portion of the substrate that extends into the insulating structure or a portion of the insulating structure that extends into the substrate. In another aspect, a process of forming an electronic device can include patterning a substrate to define a trench and a first anchor; and forming an insulating structure within the trench and adjacent to the first anchor. In a further aspect, a process of forming an electronic device can include patterning a substrate to define a trench having a sidewall and a first pillar spaced apart from the sidewall; doping the first pillar to change a conductivity type of the first pillar; and forming an insulating structure that surrounds the first pillar.