-
公开(公告)号：US20230347437A1
公开(公告)日：2023-11-02
申请号：US18030165
申请日：2021-08-25
发明人： Tsutomu HIYAMA
摘要： Provided is a soldering device in which gas is drawn through suction ports in a first plate more uniformly than in a conventional device. A soldering device according to the present disclosure is a soldering device for performing soldering and includes a blower unit for supplying gas to an object. The blower unit includes: a first plate in which a plurality of suction ports for drawing of the gas outside the blower unit are formed; a second plate that has a plate surface facing the plurality of suction ports; a plurality of nozzles; and a fan for supplying the gas drawn through the plurality of suction ports to the plurality of nozzles. A flow path through which the gas flows and which extends from the plurality of suction ports to go through a heater and the fan and to reach the plurality of nozzles is formed in the blower unit. A part of the flow path surrounds at least a part of the second plate in directions in which the plate surface extends.
-
公开(公告)号：US20240042539A1
公开(公告)日：2024-02-08
申请号：US18380939
申请日：2023-10-17
发明人： Tsutomu HIYAMA , Nobuhiro KOJIMA
CPC分类号： B23K3/08 , B23K3/04 , G01M3/30 , B23K2101/42
摘要： Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
-
公开(公告)号：US20200282355A1
公开(公告)日：2020-09-10
申请号：US16807390
申请日：2020-03-03
发明人： Tsutomu HIYAMA
摘要： To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery device 200 according to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery device 200 including: a separation unit 400 configured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipe 500 including a second connection port 540, an inclined portion 580, and a first connection port 520, the water containing the flux flowing into the pipe 500 from the second connection port 540, the inclined portion 580 being positioned on a downstream side of the second connection port 540, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection port 520 being positioned on an upstream side of the inclined portion 580; and a pump 220 configured to supply water from the first connection port 520.
-
公开(公告)号：US20210402498A1
公开(公告)日：2021-12-30
申请号：US17328197
申请日：2021-05-24
发明人： Tsutomu HIYAMA , Nobuhiro KOJIMA
摘要： Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
-
公开(公告)号：US20150382482A1
公开(公告)日：2015-12-31
申请号：US14654956
申请日：2013-12-20
发明人： Tsutomu HIYAMA
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/082 , B23K2101/42 , H05K2203/04 , H05K2203/081
摘要： In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.
摘要翻译： 在气体吹出孔阵列结构中，能够将气体吹送到诸如印刷电路板，半导体晶片等的输送部件的整个表面，几乎同心地被吹送，并且允许被输送部件的整个表面非常 均匀地加热或冷却，喷嘴2的喷嘴图案P2被布置成与喷嘴盖3的一侧的上分离部分和下分割部分相对于其中心部分与喷嘴2的喷嘴图案P1线对称， 与输送方向正交，如图1所示。 为了使喷嘴盖3中对角地配置的排列图形变得相同，喷嘴图案P1配置成与喷嘴2的喷嘴图案P2在另一侧的上下分割部分的线对称 喷嘴盖3。
-
公开(公告)号：US20220126236A1
公开(公告)日：2022-04-28
申请号：US17600567
申请日：2020-03-06
发明人： Tsutomu HIYAMA
摘要： Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation device 700 according to the present invention includes an outer cooling unit 720 including one or two or more inner tubes 722, an outer tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the outer tube 724.
-
公开(公告)号：US20200269337A1
公开(公告)日：2020-08-27
申请号：US16788738
申请日：2020-02-12
发明人： Tsutomu HIYAMA
摘要： Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.014 秒)
