公开(公告)号：US20170009074A1

公开(公告)日：2017-01-12

申请号：US15120549

申请日：2015-02-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Yueshan He ,  Biwu Wang

IPC: C08L79/04 ,  B32B27/18 ,  H05K1/03 ,  B32B27/38 ,  B32B27/42 ,  C08J5/24 ,  B32B15/092 ,  B32B27/20

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Abstract translation: 本发明涉及一种无机阻燃树脂组合物，其基于有机固体的重量份，包含（A）1至10重量份的双马来酰亚胺树脂，（B）30至60重量份的 苯并恶嗪树脂，（C）10〜40重量份聚环氧化合物，（D）5〜25重量份含磷阻燃剂，（E）1〜25重量份固化剂， 是胺固化剂和/或酚醛树脂固化剂。 本发明还提供了由所述树脂组合物制备的用于印刷电路的预浸料，层压材料，层压材料。

公开(公告)号：US10696844B2

公开(公告)日：2020-06-30

申请号：US15120549

申请日：2015-02-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Yueshan He ,  Biwu Wang

IPC: B32B27/38 ,  B32B27/20 ,  B32B27/42 ,  B32B15/08 ,  B32B27/28 ,  C08L79/04 ,  C08L63/00 ,  C08J5/24 ,  H05K1/03 ,  C08K5/5399 ,  C08K5/521 ,  B32B27/16 ,  C08L79/08 ,  C08K5/3445 ,  C08K3/36 ,  C08L61/06 ,  C08L61/34 ,  C08K3/22 ,  B32B15/092 ,  B32B27/18

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.