公开(公告)号：US11905392B2

公开(公告)日：2024-02-20

申请号：US16546448

申请日：2019-08-21

申请人： JOHNS MANVILLE

发明人： Kiarash Alavi ,  Ameya Natu

IPC分类号： C08K5/3445 ,  C08L61/34 ,  C08L61/24 ,  C08K7/14 ,  C08G14/08 ,  C08L61/06 ,  C07D471/08 ,  C07D471/04

CPC分类号： C08K5/3445 ,  C08G14/08 ,  C08K7/14 ,  C08L61/06 ,  C08L61/24 ,  C08L61/34 ,  C07D471/04 ,  C07D471/08

摘要： Binder compositions are described that include a phenol, a urea compound, formaldehyde, and at least one cyclic urea-dialdehyde compound. The cyclic urea-dialdehyde compound forms crosslinking bonds between polymers of phenol-urea-formaldehyde when the binder composition is cured. Also described are methods of making fiberglass insulation products using the above-described binder compositions. The methods may include contacting the binder composition with glass fibers and forming an amalgam of the binder composition and the glass fibers. The amalgam may be heated to form mats of the glass fibers and binder. The mats may be processed into the fiberglass insulation products.

公开(公告)号：US20240043692A1

公开(公告)日：2024-02-08

申请号：US18297478

申请日：2023-04-07

申请人： Group14 Technologies, Inc.

发明人： Henry R. Costantino ,  Alan Tzu-Yang Chang ,  Benjamin E. Kron ,  Avery J. Sakshaug ,  Leah A. Thompkins ,  Aaron M. Feaver

IPC分类号： C09C1/48 ,  H01G11/24 ,  H01G11/34 ,  H01M4/587 ,  H01M10/06 ,  H01M12/08 ,  C08G14/08 ,  C08L61/34 ,  C08G8/22 ,  C08F2/02 ,  C01B32/05 ,  C08G69/44 ,  C08G73/06 ,  C08L77/12 ,  C08L79/04

CPC分类号： C09C1/48 ,  H01G11/24 ,  H01G11/34 ,  H01M4/587 ,  H01M10/06 ,  H01M12/08 ,  C08G14/08 ,  C08L61/34 ,  C08G8/22 ,  C08F2/02 ,  C01B32/05 ,  C08G69/44 ,  C08G73/0638 ,  C08G73/065 ,  C08L77/12 ,  C08L79/04 ,  C01P2006/12 ,  C01P2006/14 ,  H01M10/052

摘要： The present application is directed to methods for solvent-free preparation of polymers and their subsequent processing into activated carbon materials. These methods unexpectedly demonstrate ability to tune pore structure in the polymer gel and carbon produced there from, while also providing distinct advantages over the current art.

公开(公告)号：US20210116810A1

公开(公告)日：2021-04-22

申请号：US17252934

申请日：2019-07-25

申请人： TORAY INDUSTRIES, INC.

发明人： Keika HASHIMOTO ,  Yuki MASUDA ,  Yuki TAKEYAMA

IPC分类号： G03F7/038 ,  C08L79/08 ,  C08L61/34 ,  C08J5/18 ,  G03F7/039 ,  C08G73/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L49/02 ,  H01L27/12

摘要： Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

公开(公告)号：US20190322845A1

公开(公告)日：2019-10-24

申请号：US16311128

申请日：2016-06-30

申请人： Constantine KHRIPIN ,  Etienne MUNCH ,  Anne Frédérîque SALIT ,  Jessica MCDOWELL ,  Xavier SAINTIGNY ,  Compagnie Generale des Etablissements Michelin

发明人： Constantine KHRIPIN ,  Etienne MUNCH ,  Anne-Frédérique SALIT ,  Jessica MCDOWELL ,  Xavier SAINTIGNY

IPC分类号： C08L15/00 ,  C08L61/34 ,  C08L9/00 ,  B60C1/00 ,  B60C11/00

摘要： Rubber compositions having a modified rubber component selected from a modified polybutadiene rubber, a modified styrene-butadiene rubber, or combinations thereof, the modification being with a functional group having a hydrogen bond acceptor atom. Such functional group may be selected from a pyridine, a pyrrolidone, an ether, a ketone or an epoxide, the rubber composition having a Tg of between −80° C. and −110° C. The rubber composition may include an efficient plasticizing resin, which when included in a mixture consisting of the modified rubber component and 67 phr of the efficient plasticizing resin, causes a Tg of the mixture to be at least 14° C. higher than the Tg of the modified rubber component. The rubber composition may described as having the hydrogen bond acceptor atom located at least two covalent bond lengths or alternatively three covalent bond lengths from a backbone of the modified rubber component.

公开(公告)号：US20170226263A1

公开(公告)日：2017-08-10

申请号：US15519306

申请日：2015-11-24

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Takashi KOBAYASHI ,  Kentaro TAKANO ,  Masayuki KATAGIRI ,  Keita TOKUZUMI ,  Tatsuya SHIMA

IPC分类号： C08G14/12 ,  B32B15/14 ,  B32B5/02 ,  H01L23/29 ,  C08G73/06 ,  C08L61/34 ,  C08L63/00 ,  C08J5/24 ,  B32B15/098 ,  B32B7/12

CPC分类号： C08G14/12 ,  B32B5/022 ,  B32B7/12 ,  B32B15/098 ,  B32B15/14 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  C08G61/02 ,  C08G73/0655 ,  C08J5/24 ,  C08J2361/34 ,  C08L61/00 ,  C08L61/34 ,  C08L63/00 ,  C08L71/02 ,  C08L79/04 ,  C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J161/00 ,  C09J161/34 ,  C09J163/00 ,  C09J165/04 ,  C09J179/04 ,  C09J201/06 ,  C09K3/10 ,  H01L23/29

摘要： The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.

公开(公告)号：US09708440B2

公开(公告)日：2017-07-18

申请号：US14756942

申请日：2015-10-30

申请人： NOVOSET, LLC

发明人： Sajal Das ,  Christopher N. Das ,  Patrick Shipman ,  Benjamin G. Baxter

IPC分类号： C08F2/46 ,  C08G61/04 ,  C08G59/14 ,  C08L63/00 ,  C08L65/02 ,  C08L85/02 ,  B29C67/00 ,  C08L61/14 ,  C08G14/06 ,  C08G73/12 ,  C08L61/34 ,  C08L79/08

CPC分类号： C08G59/1477 ,  B29C67/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08G14/06 ,  C08G59/4014 ,  C08G63/91 ,  C08G65/485 ,  C08G73/128 ,  C08J3/243 ,  C08J2361/14 ,  C08J2361/34 ,  C08J2463/10 ,  C08K5/1539 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L65/02 ,  C08L79/08 ,  C08L79/085 ,  C08L85/02

摘要： A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

公开(公告)号：US20170158799A1

公开(公告)日：2017-06-08

申请号：US15435035

申请日：2017-02-16

申请人： HEXION INC.

发明人： Adam Daniel DOWDEN ,  Harden Christopher WREN ,  Todd Ross MILLER

IPC分类号： C08G16/02 ,  C08L97/00 ,  D21H17/58 ,  C08L61/34

CPC分类号： C08G16/0237 ,  C08H6/00 ,  C08L61/00 ,  C08L61/34 ,  C08L97/005 ,  C08L2205/025 ,  D21H17/58

摘要： Polymeric materials and methods for making the polymeric materials utilizing bisphenolic stillbottoms, lignosulfonates, or both are disclosed. In one embodiment, a polymer is provided that includes a condensate of bisphenolic stillbottoms, an optional phenolic compound independent of bisphenolic stillbottoms, an aldehyde, and a lignosulfonate compound. The condensate may further include an amino compound, a catalyst, or combinations thereof. Alternatively, the polymer may be free of a phenolic compound independent of bisphenolic stillbottoms. The polymers may be used in the manufacture of articles including composites, laminates and paper products.

公开(公告)号：US09637598B2

公开(公告)日：2017-05-02

申请号：US14766433

申请日：2014-02-03

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Hiroaki Fujiwara ,  Yuki Kitai ,  Hirosuke Saito

IPC分类号： C08L61/04 ,  C08G73/22 ,  C08J5/24 ,  H01L23/29 ,  H01L23/14 ,  C08G73/02 ,  C08K5/378 ,  C08L79/04 ,  H05K1/03 ,  B32B15/14 ,  C08L63/00 ,  C08G14/06 ,  C08L61/34 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04

CPC分类号： C08K5/378 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2581/00 ,  C08G14/06 ,  C08G59/686 ,  C08G59/687 ,  C08G73/0233 ,  C08G73/22 ,  C08J5/24 ,  C08J2379/02 ,  C08J2379/04 ,  C08K5/3445 ,  C08L61/04 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C08L79/04 ,  C08L2203/20 ,  H01L23/145 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129 ,  H01L2924/00

摘要： A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.

公开(公告)号：US20120046424A1

公开(公告)日：2012-02-23

申请号：US12858096

申请日：2010-08-17

申请人： Ganapathy S. Viswanathan ,  Raman C. Subrayan ,  Vinay Malhotra

发明人： Ganapathy S. Viswanathan ,  Raman C. Subrayan ,  Vinay Malhotra

IPC分类号： C08L61/34 ,  C08G12/26

CPC分类号： C08G14/10 ,  C08G59/623 ,  C08G59/68 ,  C08K5/05 ,  C08L61/34 ,  C08L63/00 ,  C08L63/04

摘要： Compositions and methods for forming condensates and resin compositions are provided. In one embodiment, a condensate is formed from a reaction mixture including a triazine monomer, an arylhydroxy monomer, an aldehyde monomer and an acid catalyst having a pKa value of greater than 3.8. The condensates contain up to 28 wt. % of nitrogen and have a melt viscosity of 3,000 cps or less at 175° C. The condensates may have a solubility of at least 80 wt. % solids dissolved in an organic solvent for 120 hours or greater. Also disclosed are methods for the manufacture of the condensate as well as the condensate's use in fire-retardant epoxy resin compositions suitable for the manufacture of laminates for electronic applications. There is also disclosed a glycidylated triazine-arylhydroxy-aldehyde condensate of this invention.

摘要翻译： 提供了用于形成冷凝物和树脂组合物的组合物和方法。 在一个实施方案中，由包含三嗪单体，芳基羟基单体，醛单体和pKa值大于3.8的酸催化剂的反应混合物形成冷凝物。 冷凝物含有高达28wt。 ％的氮，并且在175℃下的熔融粘度为3,000cps以下。冷凝物的溶解度可以至少为80wt。 溶于有机溶剂中的固体固体含量为120小时或更长。 还公开了用于制造冷凝物的方法以及冷凝物在适用于制造用于电子应用的层压材料的阻燃环氧树脂组合物中的用途。 还公开了本发明的缩水甘油基三嗪 - 芳基羟基 - 醛缩合物。

公开(公告)号：US20110104417A1

公开(公告)日：2011-05-05

申请号：US12915779

申请日：2010-10-29

申请人： Yi-Feng Wang ,  Tim Hsu ,  Allan S. Hay ,  Kun Li ,  Bhavin Patel

发明人： Yi-Feng Wang ,  Tim Hsu ,  Allan S. Hay ,  Kun Li ,  Bhavin Patel

IPC分类号： C08L61/34 ,  C08L79/08 ,  C08L61/16 ,  C08L81/06 ,  C08L81/04 ,  B32B1/08

CPC分类号： C08L79/04 ,  C08G65/4037 ,  C08G73/0694 ,  C08G73/1053 ,  C08G73/18 ,  C08G2650/40 ,  C08L71/00 ,  C08L79/08 ,  C08L2205/02 ,  Y10T428/139 ,  C08L2666/22 ,  C08L2666/20 ,  C08L2666/14

摘要： The present invention provides high temperature compositions comprising blends of a first polymer, poly(aryl ether ketone phthalazinone)s, and a second polymer, selected from poly(aryl ether ketone)s, poly(aryl ketone)s, poly(ether ether ketone)s, poly(ether ketone ketone)s, or polybenzimidazoles, thermoplastic polyimides, polyetherimides, poly(aryl ether sulfone)s, poly(phenylene sulfide)s, and mixtures thereof. The compositions have improved high temperature characteristics, e.g., improved high temperature load capability and improved high temperature melt processibility.

摘要翻译： 本发明提供了包含第一聚合物，聚（芳基醚酮酞嗪酮）和选自聚（芳基醚酮），聚（芳基酮），聚（醚醚酮）的第二聚合物的共混物的高温组合物 ），聚（醚酮酮）或聚苯并咪唑，热塑性聚酰亚胺，聚醚酰亚胺，聚（芳基醚砜），聚（苯硫醚）以及它们的混合物。 组合物具有改善的高温特性，例如改进的高温负载能力和改善的高温熔融加工性。