公开(公告)号：US20240010810A1

公开(公告)日：2024-01-11

申请号：US18033829

申请日：2020-11-10

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Weifeng YIN ,  Qianfa LIU ,  Jianying SHI ,  Jiangling ZHANG ,  Sha LI ,  Songgang CHAI ,  Yongjing XU ,  Cui HUO

IPC: C08K3/22 ,  C08L101/12 ,  C08J5/18 ,  C08K5/00 ,  B32B15/08

CPC classification number: C08K3/22 ,  C08L101/12 ,  C08J5/18 ,  C08K5/0066 ,  B32B15/08 ,  C08K2003/2265

Abstract: A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.

公开(公告)号：US20210301130A1

公开(公告)日：2021-09-30

申请号：US17160011

申请日：2021-01-27

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jianying SHI ,  Weifeng YIN ,  Yongjing XU ,  Shanyin YAN

IPC: C08L71/12 ,  C09J171/12 ,  C09J147/00 ,  C08L47/00 ,  C09D171/12 ,  C09D147/00 ,  B32B7/12 ,  B32B15/085 ,  B32B15/14 ,  B32B15/20

Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.