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1.发明申请THERMOSETTING RESIN SANDWICH PREPREG, PREPARATION METHOD THEREOF AND COPPER CLAD LAMINATE THEREFROM 审中-公开热固性树脂砂浆预浸料，其制备方法和铜箔层压板公开(公告)号：US20160243798A1
公开(公告)日：2016-08-25
申请号：US14378012
申请日：2014-06-10
发明人： Songgang CHAI
IPC分类号： B32B27/20 , B32B15/092 , B32B15/20 , H05K1/09 , B32B27/12 , B32B27/38 , B32B37/14 , H05K1/03 , B32B5/02 , B32B27/08
CPC分类号： B32B27/20 , B32B5/022 , B32B5/024 , B32B15/092 , B32B15/20 , B32B27/08 , B32B27/12 , B32B27/38 , B32B37/14 , B32B2038/0076 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2305/076 , B32B2307/204 , B32B2457/08 , D06N3/0006 , D06N3/0011 , D06N3/0022 , D06N3/0063 , D06N3/103 , D06N2201/02 , D06N2201/08 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K3/022 , H05K2201/0129 , H05K2201/026
摘要： The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.
摘要翻译： 本发明涉及一种热固性树脂夹层预浸料，以及由此制成的覆铜层压板和多层印刷电路布线板。 热固性树脂夹层预浸料的中间层含有高填充剂含量的热固性树脂组合物，预浸料的外层含有填料含量低的热固性树脂组合物。 通过使用预浸料制备的覆铜层压板对金属箔具有良好的粘附性，绝缘性和均匀的介电常数分布。
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公开(公告)号：US20240294731A1
公开(公告)日：2024-09-05
申请号：US18575176
申请日：2022-07-27
发明人： Qing WANG , Qianfa LIU , Dongliang LIU , Jinchao DONG , Songgang CHAI , Yongjing XU , Yanhua ZHANG
IPC分类号： C08K3/36 , C08J5/24 , C08L63/00 , C09J163/00
CPC分类号： C08K3/36 , C08J5/247 , C08L63/00 , C09J163/00 , C08J2363/00 , C08J2371/12 , C08J2433/24 , C08J2461/06 , C08J2467/00 , C08K2201/005
摘要： A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
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公开(公告)号：US20240287282A1
公开(公告)日：2024-08-29
申请号：US18575212
申请日：2022-07-27
发明人： Naidong SHE , Qianfa LIU , Zengbiao HUANG , Yongjing XU , Songgang CHAI , Yanhua ZHANG
CPC分类号： C08K3/36 , C08J5/244 , C08J5/249 , C09D7/61 , C09D7/68 , C09D7/69 , C09J7/30 , C09J11/04 , C08J2363/00 , C08K2201/005 , C09J2400/166 , C09J2463/00 , H05K1/0366
摘要： The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
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公开(公告)号：US20230202126A1
公开(公告)日：2023-06-29
申请号：US17980053
申请日：2022-11-03
发明人： Wei LIANG , Songgang CHAI , Qianfa LIU , Liangpeng HAO
摘要： Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.
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5.发明公开公开(公告)号：US20240010810A1
公开(公告)日：2024-01-11
申请号：US18033829
申请日：2020-11-10
发明人： Weifeng YIN , Qianfa LIU , Jianying SHI , Jiangling ZHANG , Sha LI , Songgang CHAI , Yongjing XU , Cui HUO
IPC分类号： C08K3/22 , C08L101/12 , C08J5/18 , C08K5/00 , B32B15/08
CPC分类号： C08K3/22 , C08L101/12 , C08J5/18 , C08K5/0066 , B32B15/08 , C08K2003/2265
摘要： A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.
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公开(公告)号：US20230192972A1
公开(公告)日：2023-06-22
申请号：US17766440
申请日：2020-12-17
发明人： Songgang CHAI , Qianfa LIU , Liangpeng HAO , Wei LIANG
CPC分类号： C08J5/18 , C08L27/18 , C08K7/18 , C08K9/06 , H05K1/0373 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/025 , C08L2205/03 , C08J2327/18 , C08J2471/02 , C08J2427/18 , C08K2201/005 , H05K2201/0209
摘要： The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
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公开(公告)号：US20160229990A1
公开(公告)日：2016-08-11
申请号：US15028578
申请日：2013-10-11
发明人： Cuiming DU , Liangpeng HAO , Songgang CHAI
CPC分类号： C08K5/5398 , B32B7/10 , B32B15/08 , B32B15/20 , B32B27/18 , B32B27/20 , B32B27/26 , B32B27/28 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/02 , B32B2264/101 , B32B2264/102 , B32B2264/104 , B32B2264/12 , B32B2307/30 , B32B2457/08 , C08G59/063 , C08G59/245 , C08G59/40 , C08G59/4021 , C08G59/686 , C08G77/12 , C08G77/20 , C08J5/10 , C08J5/24 , C08J2300/24 , C08J2363/00 , C08J2483/04 , C08K3/22 , C08K3/36 , C08K5/05 , C08K5/39 , C08K2003/2227 , C08L61/04 , C08L63/00 , C08L83/04 , C08L2203/20 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K2201/0162 , H05K2201/0206 , H05K2201/0209 , H05K2201/068 , H05K2203/121 , C08K5/56 , C08K5/3445
摘要： A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
摘要翻译： 公开了一种包含热固性树脂，无机填料和有机钼化合物的热固性树脂组合物。 热固性树脂组合物可用于制备树脂消泡剂和预浸料坯，其中预浸料用于层压板和印刷电路板。
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