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1.发明申请公开(公告)号：US20180126701A1
公开(公告)日：2018-05-10
申请号：US15529335
申请日：2016-09-08
发明人： Jiang YOU , Tianhui HUANG , Yongjing XU , Zhongqiang YANG
CPC分类号： B32B15/092 , B32B27/18 , B32B33/00 , C08G59/32 , C08G59/62 , C08J2300/24 , C08K3/36 , C08K5/357 , C08L63/00
摘要： The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.
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2.发明公开公开(公告)号：US20240010810A1
公开(公告)日：2024-01-11
申请号：US18033829
申请日：2020-11-10
发明人： Weifeng YIN , Qianfa LIU , Jianying SHI , Jiangling ZHANG , Sha LI , Songgang CHAI , Yongjing XU , Cui HUO
IPC分类号： C08K3/22 , C08L101/12 , C08J5/18 , C08K5/00 , B32B15/08
CPC分类号： C08K3/22 , C08L101/12 , C08J5/18 , C08K5/0066 , B32B15/08 , C08K2003/2265
摘要： A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.
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3.发明申请公开(公告)号：US20170283610A1
公开(公告)日：2017-10-05
申请号：US15316880
申请日：2016-09-14
发明人： Hui LI , Kehong FANG , Yongjing XU
摘要： The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.
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4.发明申请公开(公告)号：US20230063436A1
公开(公告)日：2023-03-02
申请号：US17788966
申请日：2020-03-31
发明人： Zengbiao HUANG , Huayong FAN , Yongjing XU , Jianlong HUANG , Naidong SHE
摘要： Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
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5.发明申请公开(公告)号：US20230045848A1
公开(公告)日：2023-02-16
申请号：US17789005
申请日：2020-03-31
发明人： Huayong FAN , Zengbiao HUANG , Yongjing XU
摘要： Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
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公开(公告)号：US20220210914A1
公开(公告)日：2022-06-30
申请号：US17605820
申请日：2020-01-14
发明人： Guangbing CHEN , Xianping ZENG , Yongjing XU , Yongming ZHU
IPC分类号： H05K1/03 , H05K1/09 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , C08L9/00 , C08L9/06 , C08L51/08
摘要： A copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less than 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than −158 dBc (700 MHz/2600 MHz).
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7.发明申请公开(公告)号：US20180362762A1
公开(公告)日：2018-12-20
申请号：US15736887
申请日：2017-03-29
发明人： Long XI , Jiang LI , Yongjing XU
摘要： The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention greatly promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and can achieve a low coefficient of thermal expansion.
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公开(公告)号：US20160115313A1
公开(公告)日：2016-04-28
申请号：US14894789
申请日：2013-05-30
发明人： Junqi TANG , Yongjing XU
CPC分类号： C08L63/04 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J5/24 , C08J2361/14 , C08J2363/04 , C08J2461/14 , C08J2463/04 , C08L61/14 , C08L2203/20 , H05K1/0326 , H05K1/0373
摘要： The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A) and an epoxy resin (B) with a structure of formula (I). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
摘要翻译： 本发明涉及氰酸酯树脂组合物，预浸料，层压体，覆盖金属箔的层压板和使用它们制成的印刷电路板。 氰酸酯树脂组合物包含具有式（I）结构的氰酸酯树脂（A）和环氧树脂（B）。 本发明的氰酸酯树脂组合物和通过使用氰酸酯树脂组合物制备的预浸料，层压体和金属箔覆层压板具有良好的耐湿性，耐热性，阻燃性和可靠性，并且适合用作基材 用于制造高密度印刷电路板的材料。
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公开(公告)号：US20160108230A1
公开(公告)日：2016-04-21
申请号：US14894868
申请日：2013-05-30
发明人： Junqi TANG , Yongjing XU
CPC分类号： C08L63/04 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/3065 , B32B2307/7246 , B32B2457/08 , C08J5/24 , C08J2361/14 , C08J2363/00 , C08J2363/04 , C08J2365/00 , C08J2461/14 , C08J2463/04 , C08L61/14 , C08L65/00 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/20 , C08L2205/025 , C08L2205/03 , H05K1/0353 , H05K1/0366 , H05K2201/0209
摘要： The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
摘要翻译： 本发明涉及氰酸酯树脂组合物，预浸料，层压体，覆盖金属箔的层压板和使用它们制成的印刷电路板。 氰酸酯树脂组合物包含氰酸酯树脂（A），具有式（I）结构的环氧树脂（B）和马来酰亚胺化合物（C）。 本发明的氰酸酯树脂组合物和通过使用氰酸酯树脂组合物制备的预浸料，层压体和金属箔覆层压板具有良好的耐湿性，耐热性，阻燃性和可靠性，并且适合用作基材 用于制造高密度印刷电路板的材料。
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公开(公告)号：US20160007452A1
公开(公告)日：2016-01-07
申请号：US14647412
申请日：2014-02-19
发明人： Shanyin YAN , Xianping ZENG , Yongjing XU , Zhongqiang YANG , Xiaosheng SU , Li Luo
CPC分类号： H05K1/0306 , C03C25/16 , C03C25/30 , C03C25/326 , C03C25/36 , C08J5/24 , C08J2323/20 , C08J2363/00 , C08J2371/12 , C08J2379/04 , H05K1/0366 , H05K1/0393 , H05K3/0011 , H05K3/0085 , H05K2201/029
摘要： The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
摘要翻译： 本发明涉及一种制备用于构成电路基板的接合片的方法，包括用玻璃织物预处理玻璃织物与具有相同或接近介电常数（DK）的预处理清漆。 本发明还涉及通过该方法制备的粘合片以及电路基片。 本发明的具有较低成本的电路基板的制造方法不需要升级或调整设备。 由此制备的电路基板在介电常数方面具有较少的经向和纬向差异，因此可以有效地解决信号时间延迟的问题。
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