-
公开(公告)号：US12114436B2
公开(公告)日：2024-10-08
申请号：US18054157
申请日：2022-11-10
发明人： Zhicheng Yang , Xianyou Deng , Jinfeng Liu , Hegen Zhang , Tao Luo , Zhishen Wang
CPC分类号： H05K3/361 , H05K1/142 , H05K3/4611 , H05K2201/09163 , H05K2203/061
摘要： A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.
-
公开(公告)号：US11641719B2
公开(公告)日：2023-05-02
申请号：US16953331
申请日：2020-11-20
发明人： Hegen Zhang , Xianyou Deng , Jinfeng Liu , Fuyu Xiang , Bo Wang , Zhicheng Yang
摘要： The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.
-
搜索结果
2 条记录 (耗时 0.011 秒)
