公开(公告)号：US20150305164A1

公开(公告)日：2015-10-22

申请号：US14647807

申请日：2015-01-11

Applicant: SHENZHEN CHINA STAR OPTOELECTRONIC TECHNOLOGY CO., LTD.

Inventor： Che-chang HU ,  Kuang-Yao CHANG ,  Qian CAO

IPC: H05K3/02 ,  F21V29/70

CPC classification number: H05K3/02 ,  F21V29/70 ,  H05K1/056 ,  H05K2201/0761 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/302

Abstract: A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.

Abstract translation: 提供一种用于制造背光模块的印刷电路板的方法。 印刷电路板包括光条区域和散热区域。 用于安装背光模块的光棒并形成有用于为光棒供电的导电电路的光条区域。 散热区域与光条区域连接。 对光棒区域和散热区域的连接位置进行切割以形成位于印刷电路板侧的狭槽，以防止散热区域与光条的导电电路之间的短路 地区。 切割部分地穿透其上形成有导电电路的电介质层的厚度，以便将光条区域与散热区域完全分离。