SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

    公开(公告)号:US20250091095A1

    公开(公告)日:2025-03-20

    申请号:US18891253

    申请日:2024-09-20

    Abstract: According to one embodiment, a substrate cleaning apparatus includes: a cleaning liquid supply unit for supplying a cleaning liquid to a rotating substrate, a first cleaning head for cleaning at least one surface of the rotating substrate by bringing a brush into contact with the one surface of the substrate, a second cleaning head for cleaning the one surface of the substrate by bringing a brush into contact with the one surface of the substrate, a turning arm for turning the first cleaning head and the second cleaning head, and a controller. The controller controls the turning arm such that, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate to perform cleaning, the brush of the other is positioned at a position outside the substrate.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20230307262A1

    公开(公告)日:2023-09-28

    申请号:US18123793

    申请日:2023-03-20

    CPC classification number: H01L21/6708 H01L21/67253

    Abstract: According to one embodiment, a substrate processing apparatus includes: a holding unit that holds a substrate; a driving unit that is provided in the holder and rotates the substrate together with the holder; a supply unit that supplies a processing liquid to a target surface of the substrate; a first cup provided to surround the substrate; a second cup provided to surround the first cup and having an inner wall surface having a property different from a property of an inner wall surface of the first cup; and a movement controller that moves the first cup and the second cup such that the processing liquid scattered from the substrate is received either on the inner wall surface of the first cup or on the inner wall surface of the second cup.

    SUBSTRATE GRIPPING DEVICE AND SUBSTRATE PROCESSING APPARATUS
    3.
    发明申请
    SUBSTRATE GRIPPING DEVICE AND SUBSTRATE PROCESSING APPARATUS 有权
    基板搬运装置和基板加工装置

    公开(公告)号:US20140299166A1

    公开(公告)日:2014-10-09

    申请号:US14247329

    申请日:2014-04-08

    CPC classification number: H01L21/68728

    Abstract: A rotary table; a drive motor M configured to rotate the rotary table; a pin base supported by the rotary table; a pin fixing member configured to move closer to or away from C1 upon the pin base revolving; first chuck pins and second chuck pins provided on the pin fixing member and configured to be into contact with an outer edge of the substrate W; a substrate gripping force generation mechanism including a spring member; a chuck pin switching mechanism including an inertia member configured to be rotated coaxially with the rotary table and a protruded member provided on an outer peripheral part of the inertia member; and a cum member provided on the pin fixing member and configured to engage with protruded member.

    Abstract translation: 旋转台; 构造成旋转所述旋转台的驱动马达M; 由转台支撑的销座; 销固定构件,其构造成在销基座旋转时靠近或远离C1移动; 第一卡盘销和第二卡盘销设置在销固定构件上并且构造成与基板W的外边缘接触; 包括弹簧部件的基板夹紧力产生机构; 卡盘销切换机构,其包括构造成与所述旋转台同轴旋转的惯性构件和设置在所述惯性构件的外周部上的突出构件; 以及设置在销固定构件上并构造成与突出构件接合的暨构件。

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