公开(公告)号：US20020117267A1

公开(公告)日：2002-08-29

申请号：US10060219

申请日：2002-02-01

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yoshitsugu Ogawa ,  Shinichi Ogimoto ,  Kunihiro Iwanaga

IPC: B31F005/00

CPC classification number: H01L21/67144 ,  H01L21/67092 ,  Y10T156/1744

Abstract: An electric component compression bonding machine for bonding a plurality of electric components arranged in a row to a substrate is described. The bonding machine comprises: a pressure application tool for applying a pressure to the electric components; a pressure receiving tool located opposed to the pressure application tool; a substrate supporting tool for supporting the substrate between the pressure application tool and the pressure receiving tool; a moving unit for moving the substrate supported by the substrate supporting tool relative to the pressure application tool; a control unit connected to the moving unit and taking control of the moving unit in order to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool for compression bonding the electric components to the substrate by the pressure application tool, wherein the control unit controls the moving unit to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool in order that any one of the ends of the pressure application tool is positioned apart from the row of the electric components or positioned between adjacent ones of the electric components.

Abstract translation: 描述了用于将布置成行的多个电气部件接合到基板的电气部件压接机。 粘合机包括：用于向电气部件施加压力的压力施加工具; 与所述压力施加工具相对设置的压力接收工具; 用于在压力施加工具和压力接收工具之间支撑衬底的衬底支撑工具; 移动单元，用于相对于所述压力施加工具移动由所述基板支撑工具支撑的所述基板; 连接到移动单元并且控制移动单元的控制单元，以便调节由基板支撑工具支撑的基板相对于压力施加工具的位置，用于通过压力施加工具将电气部件压接在基板上 ，其中所述控制单元控制所述移动单元以相对于所述压力施加工具调节由所述基板支撑工具支撑的所述基板的位置，以使所述压力施加工具的所述端部中的任一个与所述电力行 部件或位于相邻的电气部件之间。