公开(公告)号：US20040233373A1

公开(公告)日：2004-11-25

申请号：US10704723

申请日：2003-11-10

Applicant: Shibaura Mechatronics Corporation

Inventor： Shinichi Ogimoto

IPC: G02F001/1339

CPC classification number: G02F1/1341 ,  G02F2001/13415

Abstract: The present invention comprises an application step of applying a sealing agent 7 onto one of two substrates 3 and 4 in the form of a frame having corner portions, a dropping step of dropping a liquid material onto one of the two substrates with a predetermined arrangement pattern and dropping the liquid material only to corner portions of a peripheral portion deviating from the arrangement pattern in an area surrounded by the sealing agent, and a bonding step of bonding the two substrates to each other in a reduced pressure atmosphere.

Abstract translation: 本发明包括将密封剂7施加到具有角部的框架形式的两个基板3和4中的一个上的施加步骤，以预定布置图案将液体材料滴落到两个基板中的一个基板上的下落步骤 并且将液体材料仅仅放置在由密封剂包围的区域中偏离布置图案的周边部分的角部分，以及在减压气氛中将两个基板彼此接合的接合步骤。

公开(公告)号：US20020124399A1

公开(公告)日：2002-09-12

申请号：US10082094

申请日：2002-02-26

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Shinichi Ogimoto

IPC: H05K003/30 ,  B23P019/00

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

Abstract: An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member. The electronic component holding head has a main electronic component holding unit, a vacuum chucking part facing the surface of the electronic component to be held by vacuum chucking so as to hold the electronic component, and a light path for guiding light shined onto a positioning mark formed at an edge part of the electronic component for the purpose of correcting a position offset between the electronic component and the substrate to which the electronic component is to be mounted, the vacuum chucking part holding the electronic component at a position which is on a straight line substantially parallel to an edge of the electronic component and substantially mutually orthogonal over the positioning mark of the electronic component, and which avoids the positioning mark.

Abstract translation: 提供电子部件保持头，使用其的电子部件安装装置和安装电子部件的方法，用于安装具有形成在膜部件上的定位标记的电子部件。 电子部件保持头具有主电子部件保持单元，真空夹紧部件，其面向电子部件的表面，以通过真空夹持来保持电子部件;以及光路，用于引导照射到定位标记上的光 形成在电子部件的边缘部分，用于校正电子部件与要安装电子部件的基板之间的位置偏移，将电子部件保持在位于直线上的位置的真空夹紧部 基本上平行于电子部件的边缘并且在电子部件的定位标记上基本上相互正交，并且避免了定位标记。

公开(公告)号：US20040217100A1

公开(公告)日：2004-11-04

申请号：US10479960

申请日：2004-06-16

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Shinichi Ogimoto ,  Koji Morita

IPC: H05B003/02 ,  B23K011/10

CPC classification number: B23K20/023 ,  B23K2101/40 ,  B23K2101/42

Abstract: An elongation amount of electronic parts to be bonded onto a substrate by thermocompression is accurately controlled, and thereby poor connection of the electronic parts is prevented. An electronic part compression bonding apparatus according to the present invention includes a compression bonding unit (41) which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit (48), a pressure control unit (83) which controls pressure, a heating unit (43) which heats the compression bonding unit (41), a temperature control unit (85), and a thermocompression bonding control unit (80) which controls the pressure control unit (83) and the heating unit (43) based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to be first pressure in a first stage in a process of the thermocompression bonding operation and second pressure, which is lower than the first pressure, in a second stage that follows the first stag

Abstract translation: 精确地控制通过热压接在基板上的电子部件的伸长量，从而防止电子部件的连接不良。 根据本发明的电子部件压接装置包括通过热压将电子部件接合到基板上的压接单元（41），压力供给单元（48），控制压力的压力控制单元（83）， 加热压缩单元（41）的加热单元（43），温度控制单元（85）和基于以下步骤控制压力控制单元（83）和加热单元（43）的热压接控制单元（80） 在从电子部件的热压接操作的开始到完成的处理期间可变地设定压力和加热温度中的至少一个的热压接合条件数据。 在热压接条件数据中，在第一阶段中的第二阶段中，在热压接操作和低于第一压力的第二压力的过程中的第一阶段将压力设定为第一压力

公开(公告)号：US20040089414A1

公开(公告)日：2004-05-13

申请号：US10686100

申请日：2003-10-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Tsutomu Makino ,  Shinichi Ogimoto

IPC: B32B031/00

CPC classification number: B32B37/003 ,  B32B2305/55 ,  B32B2309/68 ,  B32B2457/20 ,  G02F1/1339 ,  G02F1/1341 ,  G02F2001/13415

Abstract: There is disclosed a method including an applying step of applying a sealing agent onto either one of two substrates, a dropping step of dropping a predetermined amount of a liquid crystal onto either one of the two substrates, a leaving step of leaving the substrate on which the liquid crystal has been dropped to stand under a reduced pressure atmosphere for a predetermined time, and a bonding step of bonding the two substrates onto each other under the reduced pressure atmosphere, after leaving the substrate on which the liquid crystal has been dropped under the reduced pressure atmosphere for the predetermined time.

Abstract translation: 公开了一种方法，其包括将密封剂施加到两个基板中的任一个上的施加步骤，将预定量的液晶下落到两个基板中的任一个上的下落步骤，离开其上的基板的离开步骤 液晶已经在减压气氛下放置预定时间，并且在将液晶已经滴下的基板离开之后，在减压气氛下将两个基板彼此接合的接合步骤 减压气氛达预定时间。

公开(公告)号：US20040261930A1

公开(公告)日：2004-12-30

申请号：US10786402

申请日：2004-02-25

Applicant: Shibaura Mechatronics Corporation

Inventor： Shinichi Ogimoto

IPC: B32B031/00

CPC classification number: G02F1/1333 ,  B32B38/1841 ,  B32B2038/1891 ,  B32B2457/20 ,  G02F2001/133354

Abstract: There is disclosed a method comprising bonding two substrates to each other by a sealing agent, obtaining a positional shift amount between the bonded two substrates, and moving at least one of the two substrates by a correction movement amount obtained by multiplying the positional shift amount by a correction coefficient larger than 1 to correct the positional shift amount between these two substrates.

Abstract translation: 公开了一种方法，包括通过密封剂将两个基板彼此粘合，获得接合的两个基板之间的位置偏移量，并且通过将位置偏移量乘以 校正系数大于1，以校正这两个基板之间的位置偏移量。

公开(公告)号：US20040156989A1

公开(公告)日：2004-08-12

申请号：US10649700

申请日：2003-08-28

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Shinichi Ogimoto

IPC: B05D005/00

CPC classification number: G02F1/1341 ,  G02F2001/13415

Abstract: A liquid crystal dropping apparatus is capable of achieving a high-speed liquid crystal dropping operation and of improving the productivity. The liquid crystal dropping apparatus 10 includes a container 40 for containing a liquid crystal L, a liquid crystal dispensing device 20 for dropping the liquid crystal L contained in the container 40 on a substrate 1, and a stage-moving device 12 for moving the substrate 1 relative to the liquid crystal dispensing device 20. The liquid crystal dispensing device 20 includes a sucking means (suction port 21 and such) for taking out from the container 40 a quantity of the liquid crystal L corresponding to a quantity of the liquid crystal L to be dropped, a temporary storage means (storage chambers 22) for temporarily storing the liquid crystal L taken out from the container 40, and a discharge means (discharge port 23 and such) for discharging the temporarily stored liquid crystal L.

Abstract translation: 液晶滴下装置能够实现高速液晶滴下操作并提高生产率。 液晶滴下装置10包括用于容纳液晶L的容器40，用于将容纳在容器40中的液晶L滴落在基板1上的液晶分配装置20和用于移动基板的载物台移动装置12 液晶分配装置20包括用于从容器40取出与液晶L的量对应的液晶L的吸引装置（吸入口21等） 用于临时存储从容器40取出的液晶L的临时存储装置（存储室22）和用于排出临时储存的液晶L的排出装置（排出口23等）。

公开(公告)号：US20030205333A1

公开(公告)日：2003-11-06

申请号：US10385856

申请日：2003-03-12

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Ikuo Hayafuji ,  Shinichi Ogimoto

IPC: B32B031/00

CPC classification number: B30B15/0064 ,  B32B37/10 ,  B32B37/12 ,  B32B2315/08 ,  B32B2457/20

Abstract: At least when an upper glass substrate 3 held by an upper retention head 10 and a lower glass substrate 4 held by a lower retention head 11 are abutted on each other through a sealing material 5, air cylinders 25, 25 apply a lifting force balancing with a dead weight of the upper retention head 10 to the upper retention head 10 to cancel its dead weight. In this state, the upper glass substrate 3 and the lower glass substrate 4 are abutted on each other through the sealing material 5.

Abstract translation: 至少当由上保持头10保持的上玻璃基板3和由下保持头11保持的下玻璃基板4通过密封材料5彼此抵接时​​，气缸25,25施加与 将上保持头10固定到上保持头10以取消其自重。 在这种状态下，上玻璃基板3和下玻璃基板4通过密封材料5彼此抵接。

公开(公告)号：US20030159769A1

公开(公告)日：2003-08-28

申请号：US10372453

申请日：2003-02-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Shinichi Ogimoto ,  Hirokazu Masuda

IPC: B32B031/00

CPC classification number: B32B38/1841 ,  B32B37/0046 ,  B32B37/12 ,  B32B2309/68 ,  B32B2309/70 ,  B32B2315/08 ,  B32B2457/20

Abstract: A substrate laminating apparatus has an upper stage for holding an upper glass substrate and a lower stage for holding a lower glass substrate, and which laminates together the upper glass substrate and the lower glass substrate in a condition that both of the substrates are positioned relative to each other. An image pickup device photographs position detecting marks on the upper and lower glass substrates, and a moving device changes a relative distance between the image pickup device and the upper/lower glass substrates. A data acquiring device acquires data about the relative distance between the upper/lower glass substrates and the image pickup device, and a control device controls the moving device based on data about the relative distance.

Abstract translation: 基板层叠装置具有用于保持上玻璃基板的上台和用于保持下玻璃基板的下台，并且在两个基板相对于两个基板定位的条件下将上玻璃基板和下玻璃基板层叠在一起 彼此。 图像拾取装置拍摄上玻璃基板和下玻璃基板上的位置检测标记，并且移动装置改变图像拾取装置和上/下玻璃基板之间的相对距离。 数据获取装置获取关于上下玻璃基板和图像拾取装置之间的相对距离的数据，并且控制装置基于关于相对距离的数据来控制移动装置。

公开(公告)号：US20020117267A1

公开(公告)日：2002-08-29

申请号：US10060219

申请日：2002-02-01

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yoshitsugu Ogawa ,  Shinichi Ogimoto ,  Kunihiro Iwanaga

IPC: B31F005/00

CPC classification number: H01L21/67144 ,  H01L21/67092 ,  Y10T156/1744

Abstract: An electric component compression bonding machine for bonding a plurality of electric components arranged in a row to a substrate is described. The bonding machine comprises: a pressure application tool for applying a pressure to the electric components; a pressure receiving tool located opposed to the pressure application tool; a substrate supporting tool for supporting the substrate between the pressure application tool and the pressure receiving tool; a moving unit for moving the substrate supported by the substrate supporting tool relative to the pressure application tool; a control unit connected to the moving unit and taking control of the moving unit in order to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool for compression bonding the electric components to the substrate by the pressure application tool, wherein the control unit controls the moving unit to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool in order that any one of the ends of the pressure application tool is positioned apart from the row of the electric components or positioned between adjacent ones of the electric components.

Abstract translation: 描述了用于将布置成行的多个电气部件接合到基板的电气部件压接机。 粘合机包括：用于向电气部件施加压力的压力施加工具; 与所述压力施加工具相对设置的压力接收工具; 用于在压力施加工具和压力接收工具之间支撑衬底的衬底支撑工具; 移动单元，用于相对于所述压力施加工具移动由所述基板支撑工具支撑的所述基板; 连接到移动单元并且控制移动单元的控制单元，以便调节由基板支撑工具支撑的基板相对于压力施加工具的位置，用于通过压力施加工具将电气部件压接在基板上 ，其中所述控制单元控制所述移动单元以相对于所述压力施加工具调节由所述基板支撑工具支撑的所述基板的位置，以使所述压力施加工具的所述端部中的任一个与所述电力行 部件或位于相邻的电气部件之间。