公开(公告)号：US20230417662A1

公开(公告)日：2023-12-28

申请号：US18276082

申请日：2021-12-08

Applicant: SHIMADZU CORPORATION

Inventor： Takashi ONO ,  Masahiro IHARA ,  Hiromasa MARUNO ,  Satoshi MATSUOKA ,  Eri MATSUTANI ,  Yusuke KOGA

IPC: G01N21/3563

CPC classification number: G01N21/3563 ,  G01N2021/3595

Abstract: One mode of an optical inspection apparatus according to the present invention is an optical inspection apparatus for optically inspecting an object, the optical inspection apparatus including: a biasing section (20) configured to apply, to a group of objects (23A) on a stage, a force for moving the group of objects away with respect to the stage (22); a catching section (24) including an adhesion portion (241) to which an object in the group of objects moved from the stage adheres; and an analysis section (3) configured to optically analyze the object caught by the catching section. This makes it possible to efficiently and satisfactorily perform optical analysis of individual microplastics by eliminating manual work of picking up the microplastics one by one.

公开(公告)号：US20170169983A1

公开(公告)日：2017-06-15

申请号：US15365052

申请日：2016-11-30

Applicant: SHIMADZU CORPORATION

Inventor： Yusuke KOGA ,  Sadamu TOMITA ,  Takumi KOBAYASHI

IPC: H01J35/06 ,  H05G1/02 ,  H01J35/08

CPC classification number: H01J35/06 ,  H01J35/08 ,  H05G1/02

Abstract: An emitter for an X-ray tube device is configured to irradiate an anode with electrons for X-ray emission. The emitter includes an electron emission portion to be heated by an electric current, a current application leg for supplying the electric current to the electron emission portion, a support leg, a current application leg fixing portion for supporting the current application leg and supplying the electric current to the current application leg, and a support leg fixing portion for supporting the support leg. At least one of materials and shapes are different between the current application leg fixing portion and the support leg fixing portion so that a difference in an amount of thermal deformation between the current application leg and the support leg in a direction vertical to the electron emission portion is reduced when the electron emission portion is heated.