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公开(公告)号：US20240283121A1
公开(公告)日：2024-08-22
申请号：US18436391
申请日：2024-02-08
CPC分类号： H01P3/121 , H01P11/002
摘要： A waveguide substrate includes a core substrate through which first through holes and second through holes are formed, a first conductive layer covering an inner wall of the first through holes and both sides of the core substrate, a second conductive layer covering an inner wall of the second through holes and both sides of the core substrate, a first filler material filling a space surrounded by the first conductive layer inside the first through holes, a second filler material filling a space surrounded by the second conductive layer inside the second through holes, and third conductive layers disposed on respective sides of the core substrate, the third conductive layers overlapping the first and second through holes in a plan view, and the third conductive layers being electrically connected to the first and second conductive layers, wherein the second conductive layer overlaps the first through holes in the plan view.
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公开(公告)号：US20240332772A1
公开(公告)日：2024-10-03
申请号：US18526349
申请日：2023-12-01
发明人： Hiroshi TANEDA , Tatsuki SUMI , Yoko NAKABAYASHI
CPC分类号： H01P3/121 , H01P3/122 , H01P11/002 , H05K1/0237 , H05K3/4682 , H05K2201/09985 , H05K2203/0723 , H05K2203/107
摘要： A wiring board has a built-in post wall waveguide having a region surrounded by two mutually opposing conductors and first and second post walls connecting the two conductors and serving as a transmission path for electromagnetic waves. The conductors oppose each other with insulating layers interposed therebetween. The first post wall has first columnar portions, formed by a laminate of via interconnects penetrating the insulating layers, arranged at predetermined intervals in a first direction in which the electromagnetic waves are transmitted. The second post wall has second columnar portions similar to the first columnar portions. In a cross sectional view taken in a second direction perpendicular to the first direction, an interval between adjacent via interconnects in one of the insulating layers not in contact with the conductor is wider than an interval between adjacent via interconnects in two of the insulating layers in contact with the two conductors, respectively.
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