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公开(公告)号:US09070938B2
公开(公告)日:2015-06-30
申请号:US13723340
申请日:2012-12-21
Applicant: SHOWA DENKO K.K. , Showa Denko Packaging Co., Ltd.
Inventor: Daisuke Hashimoto , Takurou Watanabe , Keiichi Yokoi , Hiroshi Hata
Abstract: A terminal lead 1 includes an inner end portion 1a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6, an outer end portion 1b to be arranged outwardly of the exterior casing 9, and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9x of the exterior casing 9. In this terminal lead 1, a surface coating layer 3 is formed on both surfaces 2p and 2p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3a and 3a of the surface coating layer 3 formed on both surfaces 2p and 2p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3b thereof.
Abstract translation: 端子引线1包括:内端部1a,其设置在容纳电化学元件6的外部壳体9的内部,外部壳体9的外侧设置的外侧端部1b;以及作为 基材。 绝缘树脂膜4配置在与外壳9的密封部9x对应的端子引线1的部分。在该端子引线1中,在金属基板的两面2p,2p上形成有表面被覆层3 2的厚度方向。 在金属基板2的厚度方向的两面2p,2p上形成的表面被覆层3的两宽度方向端部3a,3a的涂布量比宽度方向的中间部3b小。