公开(公告)号：US20230243606A1

公开(公告)日：2023-08-03

申请号：US17925010

申请日：2021-03-29

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Koji MINAMITANI ,  Terutoshi KUMAKI

IPC: F28F21/06 ,  F28F3/12 ,  B32B15/08 ,  B32B7/12 ,  B32B37/12 ,  B32B1/00

CPC classification number: F28F21/065 ,  F28F3/12 ,  B32B15/08 ,  B32B7/12 ,  B32B37/12 ,  B32B1/00 ,  B32B2037/1253 ,  H01M2220/20 ,  H01M10/6568

Abstract: A heat exchanger includes an outer packaging member. The outer packaging member is configured to allow a heat transfer medium flowed to an inside of the outer packaging member from a heat transfer medium inlet to pass through the inside and flow out from a heat transfer medium outlet. The outer packaging member is made of outer packaging laminate materials each including a metal heat transfer layer and a resin thermal fusion layer provided on one surface of the heat transfer layer. The outer packaging laminate materials are superimposed one on the other. The thermal fusion layers are integrally bonded along peripheral edge portions of the outer packaging laminate materials. The heat transfer layer and the thermal fusion layer of the outer packaging laminate material are laminated via an inner adhesive agent layer made of an acid-modified polyolefin-based adhesive agent containing an acid-modified polyolefin-based resin.

公开(公告)号：US20190322076A1

公开(公告)日：2019-10-24

申请号：US16312765

申请日：2017-04-28

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Wei HE ,  Terutoshi KUMAKI ,  Makoto KARATSU ,  Takashi NAGAOKA

IPC: B32B15/08 ,  B32B7/12 ,  H01M2/02 ,  H01M10/0525 ,  H01G11/78 ,  H01G11/18

Abstract: Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity.[Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layer 2 serving as an outer layer, a heat fusible resin layer 3 serving as an inner layer, and a metal foil layer 4 disposed between both the two layers. The heat resistant resin layer 2 is composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5 composed of a cured film of an electron beam curable resin composition.