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1.
公开(公告)号:US20170005299A1
公开(公告)日:2017-01-05
申请号:US15196211
申请日:2016-06-29
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Tetsunobu KURAMOTO , Yuji MINAMIBORI , Takashi NAGAOKA
IPC: H01M2/02 , H01M10/0525
CPC classification number: H01M2/0202 , H01G11/78 , H01M2/026 , H01M2/0262 , H01M2/0267 , H01M2/0275 , H01M2/0277 , H01M2/0285 , H01M2/0287 , H01M10/0525
Abstract: A package for a power storage device includes a metal foil layer, an insulation layer laminated on at least center portion of one surface of the metal foil layer, and a heat-sealable resin layer arranged one surface of the metal foil layer or a region corresponding to a periphery of the one surface of the metal foil layer. With this, thinning, weight saving, and shortening of the production time can be attained.
Abstract translation: 用于蓄电装置的封装包括金属箔层,层叠在金属箔层的一个表面的至少中心部分上的绝缘层和布置在金属箔层的一个表面上的可热封树脂层或相应的区域 到金属箔层的一个表面的周边。 由此,可以实现减薄,减轻重量并缩短生产时间。
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公开(公告)号:US20170092904A1
公开(公告)日:2017-03-30
申请号:US15278563
申请日:2016-09-28
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Daisuke NAKAJIMA , Makoto KARATSU , Takashi NAGAOKA
IPC: H01M2/02 , H01M10/0525 , H01M2/08
CPC classification number: H01M2/0287 , B32B7/12 , B32B15/06 , B32B15/085 , B32B15/088 , B32B15/09 , B32B15/18 , B32B15/20 , B32B25/14 , B32B27/08 , B32B27/18 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2250/04 , B32B2250/05 , B32B2270/00 , B32B2274/00 , B32B2307/306 , B32B2307/518 , B32B2307/558 , B32B2307/724 , B32B2435/02 , B32B2457/10 , B32B2457/16 , H01M2/0277 , H01M2/0285 , H01M2/08 , H01M10/0525
Abstract: A sealant film has a structure made of a laminated body of two or more layers. The laminated body includes a first resin layer 7 containing 50 mass % or more of a random copolymer containing propylene and a copolymer component other than propylene as copolymer components, and a second resin layer 8 formed by a mixed resin containing a first elastomer-modified olefin based resin having a melting point of 155° C. or higher and a crystal melting energy of 50 J/g or more, and a second elastomer-modified olefin based resin having a melting point is 135° C. or higher and a crystal melting energy of 30 J/g or less. With this structure, when the inner pressure of a power storage device is excessively increased, breakage (separation) occurs inside the sealant layer, causing gas-releasing, which in turn can prevent bursting of the packaging material due to the inner pressure increase.
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公开(公告)号:US20240243394A1
公开(公告)日:2024-07-18
申请号:US18585881
申请日:2024-02-23
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Wei HE , Hiroaki ITO , Takashi NAGAOKA , Makoto KARATSU
IPC: H01M50/124 , B32B1/08 , B32B7/027 , B32B7/12 , B32B15/082 , B32B15/085 , B32B15/088 , B32B15/09 , B32B15/20 , B32B27/06 , B32B27/16 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/02 , B32B37/06 , B32B37/12 , B32B37/24 , H01M10/052 , H01M10/0525 , H01M50/119 , H01M50/121 , H01M50/129 , H01M50/131
CPC classification number: H01M50/124 , B32B1/08 , B32B7/027 , B32B7/12 , B32B15/082 , B32B15/085 , B32B15/088 , B32B15/09 , B32B15/20 , B32B27/06 , B32B27/16 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/02 , B32B37/06 , B32B37/12 , H01M10/0525 , H01M50/119 , H01M50/121 , H01M50/129 , H01M50/131 , B32B2037/1253 , B32B2037/243 , B32B2250/03 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/31 , B32B2307/50 , B32B2307/518 , B32B2307/54 , B32B2307/714 , B32B2307/7244 , B32B2307/7246 , B32B2307/732 , B32B2307/736 , B32B2307/738 , B32B2309/02 , B32B2309/105 , B32B2311/24 , B32B2333/04 , B32B2375/00 , B32B2377/00 , B32B2439/00 , B32B2439/70 , B32B2439/80 , B32B2457/10 , B32B2553/00 , B32B2605/00 , H01M10/052 , H01M2220/10 , H01M2220/20 , H01M2220/30
Abstract: The packaging material includes a heat-resistant resin layer 2 as an outer side layer, a heat-fusible resin layer 3 as an inner side layer, and a metal foil layer 4 arranged between these layers. The heat-resistant resin layer 2 is made of a heat-resistant resin film having a hot water shrinkage rate of 1.5% to 12% and the heat-resistant resin layer 2 and the metal foil layer 4 are adhered via an outer side adhesive layer 5. The adhesive layer 5 is formed by an urethane adhesive agent containing a polyol, a polyfunctional isocyanate compound, and an aliphatic compound containing a plurality of functional groups capable of reacting with an isocyanate group in one molecule. With this, a packaging material can be provided in which excellent formability can be secured and delamination can be sufficiently suppressed without causing pinholes, etc., even when deep depth drawing is performed.
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4.
公开(公告)号:US20230382084A1
公开(公告)日:2023-11-30
申请号:US18231487
申请日:2023-08-08
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Kenji YOSHINO , Makoto KARATSU , Takashi NAGAOKA
IPC: B32B15/085 , H01M50/231 , H01M50/202 , B32B7/12 , B32B27/18 , B32B37/12 , B32B38/00 , B65D65/40 , H01M10/0525 , H01M50/105
CPC classification number: B32B15/085 , H01M50/231 , H01M50/202 , B32B7/12 , B32B27/18 , B32B37/12 , B32B38/0036 , B65D65/40 , H01M10/0525 , H01M50/105 , B32B2307/30 , B32B2457/10 , B32B2553/00
Abstract: A molding packaging material is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between the two layers. The heat fusible resin layer is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.
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公开(公告)号:US20190322076A1
公开(公告)日:2019-10-24
申请号:US16312765
申请日:2017-04-28
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Wei HE , Terutoshi KUMAKI , Makoto KARATSU , Takashi NAGAOKA
Abstract: Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity.[Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layer 2 serving as an outer layer, a heat fusible resin layer 3 serving as an inner layer, and a metal foil layer 4 disposed between both the two layers. The heat resistant resin layer 2 is composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5 composed of a cured film of an electron beam curable resin composition.
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6.
公开(公告)号:US20210362473A1
公开(公告)日:2021-11-25
申请号:US16644569
申请日:2018-08-17
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Kenji YOSHINO , Makoto KARATSU , Takashi NAGAOKA
IPC: B32B15/085 , H01M10/0525 , H01M50/202 , H01M50/231 , B32B7/12 , B32B27/18 , B32B37/12 , B32B38/00 , B65D65/40
Abstract: Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer 2 as an outer layer, a heat fusible resin layer 3 as an inner layer, and a metal foil layer 4 arranged between the two layers. The heat fusible resin layer 3 is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer 3 is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.
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公开(公告)号:US20210194084A1
公开(公告)日:2021-06-24
申请号:US17132668
申请日:2020-12-23
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Daisuke NAKAJIMA , Takashi NAGAOKA
IPC: H01M50/197 , H01M50/198 , H01M50/191 , H01M50/193 , B32B15/085
Abstract: It is intended to improve formability of a battery packaging material. A sealant film 20 for a battery packaging material is a multi-layer material composed of a first non-stretched film layer 21 in which one surface thereof serves as a surface of the innermost layer of the battery packaging material 1, and one or more other non-stretched film layers 22 and 23 laminated on the other surface side of the first non-stretched film layer 21. The first non-stretched film layer 21 contains a random copolymer containing a monomer other than propylene and propylene as a copolymerization component, a homopolymer of propylene, a lubricant, and a content rate of the homopolymer to a total amount of the random copolymer and the homopolymer is 5 wt % to 30 wt %.
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公开(公告)号:US20170104189A1
公开(公告)日:2017-04-13
申请号:US15287882
申请日:2016-10-07
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Wei HE , Hiroaki ITO , Takashi NAGAOKA , Makoto KARATSU
IPC: H01M2/02 , B32B37/12 , B32B37/06 , B32B7/12 , B32B15/09 , B32B15/20 , B32B27/36 , B32B27/34 , B32B15/088 , H01M10/0525 , B32B7/02
CPC classification number: H01M2/0287 , B32B1/08 , B32B7/02 , B32B7/12 , B32B15/082 , B32B15/085 , B32B15/088 , B32B15/09 , B32B15/20 , B32B27/06 , B32B27/16 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/02 , B32B37/06 , B32B37/12 , B32B2037/1253 , B32B2037/243 , B32B2250/03 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/31 , B32B2307/50 , B32B2307/518 , B32B2307/54 , B32B2307/714 , B32B2307/7244 , B32B2307/7246 , B32B2307/732 , B32B2307/736 , B32B2307/738 , B32B2309/02 , B32B2309/105 , B32B2311/24 , B32B2333/04 , B32B2375/00 , B32B2377/00 , B32B2439/00 , B32B2439/70 , B32B2439/80 , B32B2457/10 , B32B2553/00 , B32B2605/00 , H01M2/0277 , H01M2/0285 , H01M10/052 , H01M10/0525 , H01M2220/10 , H01M2220/20 , H01M2220/30
Abstract: The packaging material includes a heat-resistant resin layer 2 as an outer side layer, a heat-fusible resin layer 3 as an inner side layer, and a metal foil layer 4 arranged between these layers. The heat-resistant resin layer 2 is made of a heat-resistant resin film having a hot water shrinkage rate of 1.5% to 12% and the heat-resistant resin layer 2 and the metal foil layer 4 are adhered via an outer side adhesive layer 5. The adhesive layer 5 is formed by an urethane adhesive agent containing a polyol, a polyfunctional isocyanate compound, and an aliphatic compound containing a plurality of functional groups capable of reacting with an isocyanate group in one molecule. With this, a packaging material can be provided in which excellent formability can be secured and delamination can be sufficiently suppressed without causing pinholes, etc., even when deep depth drawing is performed.
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公开(公告)号:US20170092903A1
公开(公告)日:2017-03-30
申请号:US15278522
申请日:2016-09-28
Applicant: SHOWA DENKO PACKAGING CO., LTD
Inventor: Daisuke NAKAJIMA , Makoto KARATSU , Takashi NAGAOKA
IPC: H01M2/02 , H01M2/08 , H01M10/0525
CPC classification number: H01M2/0287 , H01M2/0277 , H01M2/0285 , H01M2/0295 , H01M2/08 , H01M10/0525
Abstract: A sealant film has a structure made of a laminated body of two or more layers. The laminated body includes a first resin layer 7 containing 50 mass % or more of a random copolymer containing propylene and a copolymer component other than propylene as copolymer components, and a second resin layer 8 formed by a mixed resin containing a first elastomer-modified olefin based resin having a crystallization temperature of 105° C. or higher and a crystallization energy of 50 J/g or more, and a second elastomer-modified olefin based resin having a crystallization temperature is 85° C. or higher and a crystallization energy of 30 J/g or less. With this structure, when the inner pressure of a power storage device is excessively increased, breakage (separation) occurs inside the sealant layer, causing gas-releasing, which in turn can prevent bursting of the packaging material due to the inner pressure increase.
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