公开(公告)号：US20150279756A1

公开(公告)日：2015-10-01

申请号：US14440084

申请日：2013-10-31

Applicant: SILEX MICROSYSTEMS AB

Inventor： Ulf Erlesand ,  Edvard Kälvesten

IPC: H01L23/15 ,  C25D5/02 ,  H01L21/768 ,  H01L23/498 ,  B81B7/00

CPC classification number: H01L23/15 ,  B81B7/007 ,  B81C1/00095 ,  C25D5/02 ,  H01L21/50 ,  H01L21/76879 ,  H01L23/49827 ,  H01L23/49872 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Method of making through-substrate-vias in glass substrates includes providing a first substrate on which a plurality of needles protruding vertically from the substrate are made; providing a second substrate made of glass; locating the substrates adjacent each other such that the needles on the first substrate face the second substrate; applying heat to a temperature where the glass softens, by heating the glass or the needle substrate or both; applying a force such that the needles on the first substrate penetrate into the glass to provide impressions in the glass; and finally, removing the first substrate and providing material filling the impressions in the second substrate made of glass. A device includes a silicon substrate having a cavity in which a MEMS component is accommodated, and a cap wafer made of a material having a low dielectric constant, and through substrate vias of metal, is bonded to the silicon substrate.

Abstract translation: 在玻璃基板中制造贯通基板通孔的方法包括提供第一基板，其上形成有从基板垂直突出的多个针; 提供由玻璃制成的第二衬底; 将基板相邻地定位，使得第一基板上的针朝向第二基板; 通过加热玻璃或针基材或两者，将热量施加到玻璃软化的温度; 施加力，使得第一基底上的针穿透玻璃以在玻璃中产生印模; 最后，移除第一基片并提供填充由玻璃制成的第二基片的印模的材料。 一种器件包括具有其中容纳MEMS部件的空腔的硅基板和由具有低介电常数的材料制成的盖晶片，并且通过金属的基板通孔接合到硅基板。

公开(公告)号：US09607915B2

公开(公告)日：2017-03-28

申请号：US14440084

申请日：2013-10-31

Applicant: SILEX MICROSYSTEMS AB

Inventor： Ulf Erlesand ,  Edvard Kälvesten

IPC: H01L23/15 ,  C25D5/02 ,  H01L21/768 ,  H01L23/498 ,  H01L21/50 ,  B81C1/00 ,  B81B7/00

CPC classification number: H01L23/15 ,  B81B7/007 ,  B81C1/00095 ,  C25D5/02 ,  H01L21/50 ,  H01L21/76879 ,  H01L23/49827 ,  H01L23/49872 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Method of making through-substrate-vias in glass substrates includes providing a first substrate on which a plurality of needles protruding vertically from the substrate are made; providing a second substrate made of glass; locating the substrates adjacent each other such that the needles on the first substrate face the second substrate; applying heat to a temperature where the glass softens, by heating the glass or the needle substrate or both; applying a force such that the needles on the first substrate penetrate into the glass to provide impressions in the glass; and finally, removing the first substrate and providing material filling the impressions in the second substrate made of glass. A device includes a silicon substrate having a cavity in which a MEMS component is accommodated, and a cap wafer made of a material having a low dielectric constant, and through substrate vias of metal, is bonded to the silicon substrate.