公开(公告)号：US12211776B2

公开(公告)日：2025-01-28

申请号：US17574944

申请日：2022-01-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20250125237A1

公开(公告)日：2025-04-17

申请号：US18990236

申请日：2024-12-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20230223322A1

公开(公告)日：2023-07-13

申请号：US17574944

申请日：2022-01-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/49816 ,  H01L23/3121 ,  H01L24/16 ,  H01L21/4853 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/32225 ,  H01L25/0652 ,  H01L2225/06517

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.