公开(公告)号：US20240321672A1

公开(公告)日：2024-09-26

申请号：US18350839

申请日：2023-07-12

申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.

发明人： Cheng-Lun CHEN ,  Liang-Yi HUNG ,  Yu-Po WANG

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/3511

摘要： An electronic package and a manufacturing method thereof are provided, in which an electronic structure and a wall structure surrounding the electronic structure are disposed on a carrier structure, a heat conducting layer is formed on the electronic structure, and the wall structure and the heat conducting layer are covered by a heat dissipation element. Therefore, a thermal stress can be effectively dispersed by the arrangement of the wall structure, such that a warpage of the electronic structure and a heat dissipation body can be effectively controlled.