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公开(公告)号：US20240096835A1
公开(公告)日：2024-03-21
申请号：US18055890
申请日：2022-11-16
发明人： Pin-Jing SU , Liang-Yi HUNG , Yu-Po WANG
IPC分类号： H01L23/00
CPC分类号： H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/02379 , H01L2224/03515 , H01L2224/17519 , H01L2224/24998 , H01L2224/33519 , H01L2224/7525 , H01L2924/16235
摘要： A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.
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公开(公告)号：US20240321672A1
公开(公告)日：2024-09-26
申请号：US18350839
申请日：2023-07-12
发明人： Cheng-Lun CHEN , Liang-Yi HUNG , Yu-Po WANG
IPC分类号： H01L23/367 , H01L21/48 , H01L23/00 , H01L25/16
CPC分类号： H01L23/3675 , H01L21/4871 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/162 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1616 , H01L2924/16235 , H01L2924/16251 , H01L2924/1632 , H01L2924/3511
摘要： An electronic package and a manufacturing method thereof are provided, in which an electronic structure and a wall structure surrounding the electronic structure are disposed on a carrier structure, a heat conducting layer is formed on the electronic structure, and the wall structure and the heat conducting layer are covered by a heat dissipation element. Therefore, a thermal stress can be effectively dispersed by the arrangement of the wall structure, such that a warpage of the electronic structure and a heat dissipation body can be effectively controlled.
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公开(公告)号：US20240363577A1
公开(公告)日：2024-10-31
申请号：US18357596
申请日：2023-07-24
发明人： Pin-Jing SU , Wen-Yu TENG , Liang-Yi HUNG , Chia-Cheng CHEN , Yu-Po WANG
IPC分类号： H01L23/00 , H01L23/367
CPC分类号： H01L24/32 , H01L23/3675 , H01L24/16 , H01L24/33 , H01L24/73 , H01L2224/16225 , H01L2224/26145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33519 , H01L2224/73204 , H01L2224/73253 , H01L2924/1611 , H01L2924/16235 , H01L2924/1632
摘要： An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation structure is bonded on the electronic element via a heat dissipation material, so that the flow stopper limits an overflow range of the heat dissipation material to prevent the heat dissipation material from contaminating a circuit layer on the substrate body.
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