公开(公告)号：US20180358355A1

公开(公告)日：2018-12-13

申请号：US15855777

申请日：2017-12-27

Applicant: SK hynix Inc.

Inventor： Joong-Ho KIM ,  Hyun Woo KWACK ,  Ki Jong LEE ,  Doo Bock LEE

IPC: H01L27/02 ,  H01L25/065 ,  H02H9/04

CPC classification number: H01L27/0296 ,  H01L25/0657 ,  H01L27/0288 ,  H01L27/0292 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586 ,  H02H9/046

Abstract: A semiconductor system includes a control device, and a semiconductor apparatus coupled with the control device through a first line and a second line. A loading of the second line is greater than a loading of the first line, wherein the semiconductor apparatus includes a first receiving circuit which is electrically coupled with the first line and a second receiving circuit which is electrically coupled with the second line. Further a loading between the first line and the first receiving circuit is greater than a loading between the second line and the second receiving circuit.

公开(公告)号：US20210082909A1

公开(公告)日：2021-03-18

申请号：US17108824

申请日：2020-12-01

Applicant: SK hynix Inc.

Inventor： Joong-Ho KIM ,  Hyun Woo KWACK ,  Ki Jong LEE ,  Doo Bock LEE

IPC: H01L27/02 ,  H02H9/04

Abstract: A semiconductor system includes a control device, and a semiconductor apparatus coupled with the control device through a first line and a second line. A loading of the second line is greater than a loading of the first line, wherein the semiconductor apparatus includes a first receiving circuit which is electrically coupled with the first line and a second receiving circuit which is electrically coupled with the second line. Further a loading between the first line and the first receiving circuit is greater than a loading between the second line and the second receiving circuit.