公开(公告)号：US20160336196A1

公开(公告)日：2016-11-17

申请号：US14927292

申请日：2015-10-29

Applicant: SK hynix Inc.

Inventor： Jae Hee SIM ,  Si Hyun KIM

IPC: H01L21/322 ,  B08B6/00

CPC classification number: B08B6/00 ,  H01L21/02057 ,  H01L21/0209 ,  H01L21/67028

Abstract: A wafer processing apparatus includes a particle charger for charging particles adsorbed onto a wafer with photoelectrons emitted from an emitter metal layer and a particle remover for applying an electric field to the wafer, which removes the charged particles from the wafer.

Abstract translation: 一种晶片处理装置，包括用于从发射极金属层发射的光电子吸收到晶片上的颗粒的粒子充电器，以及用于向晶片施加电场的颗粒去除器，其从晶片去除带电粒子。