公开(公告)号：US10148233B2

公开(公告)日：2018-12-04

申请号：US14983256

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H03F1/56 ,  H04B1/44 ,  H03F1/02 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H03F3/24 ,  H03F3/60 ,  H04B1/12 ,  H04B1/525 ,  H04B1/04

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.

公开(公告)号：US10103695B2

公开(公告)日：2018-10-16

申请号：US14983318

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H04B1/44 ,  H04B1/525 ,  H04B1/04 ,  H03F1/56 ,  H03F3/195 ,  H03F3/213 ,  H03F1/02 ,  H03F3/24 ,  H03F3/60 ,  H03F3/21 ,  H04B1/12

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

公开(公告)号：US20160226553A1

公开(公告)日：2016-08-04

申请号：US14983318

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H04B1/44 ,  H03F3/213 ,  H03F3/195

CPC分类号： H03F1/565 ,  H03F1/0222 ,  H03F1/0227 ,  H03F3/195 ,  H03F3/211 ,  H03F3/213 ,  H03F3/24 ,  H03F3/245 ,  H03F3/601 ,  H03F3/605 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/165 ,  H03F2200/294 ,  H03F2200/375 ,  H03F2200/387 ,  H03F2200/417 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/04 ,  H04B1/123 ,  H04B1/44 ,  H04B1/525 ,  H04B2001/0408

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

摘要翻译： 射频（RF）系统的实施例包括与一个或多个功率放大器和/或其他组件集成的发射/接收开关。 功率放大器可以具有基于变压器的架构，功率放大器和开关可集成到单个互补金属氧化物半导体芯片上。

公开(公告)号：US11664829B2

公开(公告)日：2023-05-30

申请号：US17103546

申请日：2020-11-24

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Srivatsan Jayaraman ,  Omar Mustafa ,  Yalin Jin ,  Ethan Chang ,  Ying Shi ,  Reza Kasnavi ,  Philip H. Thompson ,  Kenneth Norman Warren

IPC分类号： H04B1/00 ,  H04B7/04 ,  H04W52/52 ,  H04W84/04

CPC分类号： H04B1/0057 ,  H04B7/04 ,  H04W52/52 ,  H04W84/042

摘要： Circuitry, modules and devices for integrating front-end carrier aggregation architecture, are disclosed. In some embodiments, a front-end architecture includes a switching assembly configured to provide switching for two or more frequency bands. In some embodiments, the switching assembly includes at least one coupler configured to couple a signal associated with the switching assembly. The front-end architecture can also include a diplexer circuit including a first filter configured to pass a first frequency band, a second filter configured to pass a second frequency band, and a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first and second frequency bands from the front-end architecture.

公开(公告)号：US20160226552A1

公开(公告)日：2016-08-04

申请号：US14983256

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H04B1/44 ,  H03F3/60 ,  H03F1/02 ,  H03F3/195 ,  H03F3/24

CPC分类号： H03F1/565 ,  H03F1/0222 ,  H03F1/0227 ,  H03F3/195 ,  H03F3/211 ,  H03F3/213 ,  H03F3/24 ,  H03F3/245 ,  H03F3/601 ,  H03F3/605 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/165 ,  H03F2200/294 ,  H03F2200/375 ,  H03F2200/387 ,  H03F2200/417 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/04 ,  H04B1/123 ,  H04B1/44 ,  H04B1/525 ,  H04B2001/0408

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.

摘要翻译： 射频（RF）系统的实施例包括与一个或多个功率放大器和/或其他组件集成的发射/接收开关。 功率放大器可以具有基于变压器的架构。 补偿电路可以在RF发射模式期间保护接收路径。

公开(公告)号：US10135405B2

公开(公告)日：2018-11-20

申请号：US14983322

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H03F1/56 ,  H04B1/44 ,  H04B1/04 ,  H03F3/195 ,  H03F3/213 ,  H03F1/02 ,  H03F3/24 ,  H03F3/60 ,  H03F3/21 ,  H04B1/12 ,  H04B1/525

摘要： Embodiments of radio frequency (RF) systems include a power amplifier having a primary winding and a secondary winding. The primary winding can be biased in different states in transmit and receive modes such that a difference between center frequencies of the primary winding and the secondary winding are significantly different in the different modes.

公开(公告)号：US20160248469A1

公开(公告)日：2016-08-25

申请号：US14983322

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H04B1/44 ,  H03F1/56 ,  H04B1/04 ,  H03F3/24 ,  H03F3/60 ,  H03F1/02 ,  H03F3/195

CPC分类号： H03F1/565 ,  H03F1/0222 ,  H03F1/0227 ,  H03F3/195 ,  H03F3/211 ,  H03F3/213 ,  H03F3/24 ,  H03F3/245 ,  H03F3/601 ,  H03F3/605 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/165 ,  H03F2200/294 ,  H03F2200/375 ,  H03F2200/387 ,  H03F2200/417 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/04 ,  H04B1/123 ,  H04B1/44 ,  H04B1/525 ,  H04B2001/0408

摘要： Embodiments of radio frequency (RF) systems include a power amplifier having a primary winding and a secondary winding. The primary winding can be biased in different states in transmit and receive modes such that a difference between center frequencies of the primary winding and the secondary winding are significantly different in the different modes.

摘要翻译： 射频（RF）系统的实施例包括具有初级绕组和次级绕组的功率放大器。 初级绕组可以在发射和接收模式下以不同的状态偏置，使得初级绕组和次级绕组的中心频率之间的差异在不同模式下显着不同。

公开(公告)号：US10581388B2

公开(公告)日：2020-03-03

申请号：US16136088

申请日：2018-09-19

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H03F1/56 ,  H03F3/195 ,  H03F3/213 ,  H04B1/44 ,  H03F1/02 ,  H03F3/21 ,  H04B1/12 ,  H04B1/525 ,  H03F3/24 ,  H03F3/60 ,  H04B1/04

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

公开(公告)号：US20190158043A1

公开(公告)日：2019-05-23

申请号：US16136088

申请日：2018-09-19

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H03F1/56 ,  H04B1/44 ,  H03F3/60 ,  H03F1/02 ,  H03F3/21 ,  H04B1/04 ,  H03F3/24 ,  H04B1/12 ,  H04B1/525 ,  H03F3/195 ,  H03F3/213

CPC分类号： H03F1/565 ,  H03F1/0222 ,  H03F1/0227 ,  H03F3/195 ,  H03F3/211 ,  H03F3/213 ,  H03F3/24 ,  H03F3/245 ,  H03F3/601 ,  H03F3/605 ,  H03F2200/102 ,  H03F2200/105 ,  H03F2200/165 ,  H03F2200/294 ,  H03F2200/375 ,  H03F2200/387 ,  H03F2200/417 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/537 ,  H03F2200/541 ,  H04B1/04 ,  H04B1/123 ,  H04B1/44 ,  H04B1/525 ,  H04B2001/0408

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

公开(公告)号：US10008989B2

公开(公告)日：2018-06-26

申请号：US14983256

申请日：2015-12-29

申请人： Skyworks Solutions, Inc.

发明人： Yalin Jin ,  Setu Mohta

IPC分类号： H03F1/56 ,  H04B1/44 ,  H03F3/195 ,  H03F3/213 ,  H03F1/02 ,  H03F3/24 ,  H03F3/60 ,  H04B1/04 ,  H03F3/21 ,  H04B1/12 ,  H04B1/525

摘要： Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.