公开(公告)号：US08964400B2

公开(公告)日：2015-02-24

申请号：US14210697

申请日：2014-03-14

Applicant: SMA Solar Technology AG

Inventor： Regine Mallwitz

IPC: H05K1/18 ,  H01L23/66 ,  H02M7/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/3011 ,  H02M7/003 ,  H05K1/0228 ,  H05K1/0234 ,  H05K1/0263 ,  H05K1/165 ,  H05K2201/0723 ,  H05K2201/0792 ,  H05K2201/083 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement. The conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board.

Abstract translation: 电路装置包括安装到电路板的几个电子部件，在第一导体层内的电子部件之间延伸的至少一个导体部分和闭合导体回路，该闭合导体回路包括至少一个与至少一个导体部分平行运行的回路部分 在与第一导体层相邻的第二导体层内。 闭合导体环路被配置为在电路装置的操作中减小流过导体部分的电流的振荡趋势。 通过安装到电路板的外表面的至少一个电子部件来闭合导体环路。

公开(公告)号：US20140192487A1

公开(公告)日：2014-07-10

申请号：US14210697

申请日：2014-03-14

Applicant: SMA Solar Technology AG

Inventor： Regine Mallwitz

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/3011 ,  H02M7/003 ,  H05K1/0228 ,  H05K1/0234 ,  H05K1/0263 ,  H05K1/165 ,  H05K2201/0723 ,  H05K2201/0792 ,  H05K2201/083 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement. The conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board.

Abstract translation: 电路装置包括安装到电路板的多个电子部件，在第一导体层内的电子部件之间延伸的至少一个导体部分和闭合导体回路，该闭合导体回路包括至少一个与至少一个导体部分平行运行的回路部分 在与第一导体层相邻的第二导体层内。 闭合导体环路被配置为在电路装置的操作中减小流过导体部分的电流的振荡趋势。 通过安装到电路板的外表面的至少一个电子部件来闭合导体环路。