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公开(公告)号:US20170133425A1
公开(公告)日:2017-05-11
申请号:US15319947
申请日:2015-06-16
Applicant: SONY CORPORATION
Inventor: Kenichi SHIGENAMI , Takayuki KAI , Natsuhiro AOTA , Atsushi MUTO , Yoshiyuki AKIYAMA , Takashi MIYAMOTO , Takayuki SEKIHARA , Tomohiro TAKAHASHI
IPC: H01L27/146 , H04N5/378 , H04N5/374
CPC classification number: H01L27/14636 , H01L25/04 , H01L25/18 , H01L2924/0002 , H04N5/374 , H04N5/378 , H01L2924/00
Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.
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公开(公告)号:US20180255260A1
公开(公告)日:2018-09-06
申请号:US15971460
申请日:2018-05-04
Applicant: SONY CORPORATION
Inventor: Tsutomu NAKAJIMA , Atsushi MUTO
IPC: H04N5/3745 , H04N5/376 , H01L27/146
CPC classification number: H04N5/37455 , H01L27/14607 , H01L27/14634 , H01L27/14643 , H04N5/374 , H04N5/376 , H04N5/379
Abstract: The present technology relates to an image sensor and an electronic apparatus which can make the image sensor a smaller without degrading performance of the image sensor. The image sensor includes a pixel array unit in which pixels including photoelectric conversion elements are arranged in a two dimensional manner, a row circuit configured to control row scanning of the pixel array unit, and a column processing unit configured to convert an analog signal read out from the pixel array unit into a digital signal. The pixel array unit is disposed on a first-layer substrate, and the row circuit and the column processing unit are disposed on different substrates which are underlying layers of the first-layer substrate and which are laminated on the first-layer substrate. The present technology is applicable to the image sensor.
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公开(公告)号:US20170155865A1
公开(公告)日:2017-06-01
申请号:US15127510
申请日:2015-04-03
Applicant: SONY CORPORATION
Inventor: Tsutomu NAKAJIMA , Atsushi MUTO
IPC: H04N5/3745 , H04N5/376 , H01L27/146
CPC classification number: H04N5/37455 , H01L27/14607 , H01L27/14634 , H01L27/14643 , H04N5/374 , H04N5/376
Abstract: The present technology relates to an image sensor and an electronic apparatus which can make the image sensor a smaller without degrading performance of the image sensor. The image sensor includes a pixel array unit in which pixels including photoelectric conversion elements are arranged in a two dimensional manner, a row circuit configured to control row scanning of the pixel array unit, and a column processing unit configured to convert an analog signal read out from the pixel array unit into a digital signal. The pixel array unit is disposed on a first-layer substrate, and the row circuit and the column processing unit are disposed on different substrates which are underlying layers of the first-layer substrate and which are laminated on the first-layer substrate. The present technology is applicable to the image sensor.
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