公开(公告)号：US20160204495A1

公开(公告)日：2016-07-14

申请号：US14914175

申请日：2014-08-20

Applicant: SONY CORPORATION

Inventor： TAKAHIRO TAKEDA ,  YASUHIRO OKADA

IPC: H01P5/08 ,  H04B3/02 ,  H03H7/38

CPC classification number: H01P5/087 ,  H01P5/024 ,  H01P5/107 ,  H03H7/38 ,  H04B3/02 ,  H04B5/0031

Abstract: A connector apparatus of the present disclosure is configured to include: a waveguide cable; a substrate including a waveguide structure; and a coupling section configured to electromagnetically couple an end portion of the waveguide cable to the waveguide structure. Furthermore, a communication system of the present disclosure is a communication system including: a transmitter configured to transmit high-frequency signals; a receiver configured to receive high-frequency signals; a waveguide cable configured to transmit high-frequency signals between the transmitter and the receiver; and a connector apparatus configured to connect between at least one of the transmitter and the receiver to the waveguide cable. A connector apparatus having the above-mentioned configuration is used as the connector apparatus.

Abstract translation: 本公开的连接器装置被配置为包括：波导电缆; 包括波导结构的基板; 以及耦合部分，被配置为将波导电缆的端部电磁耦合到波导结构。 此外，本公开的通信系统是通信系统，包括：发射机，被配置为发送高频信号; 接收器，被配置为接收高频信号; 波导电缆，被配置为在发射机和接收机之间传输高频信号; 以及连接器装置，被配置为将所述发射器和所述接收器中的至少一个连接到所述波导电缆。 使用具有上述结构的连接器装置作为连接器装置。

公开(公告)号：US20190081376A1

公开(公告)日：2019-03-14

申请号：US16093747

申请日：2017-03-31

Applicant: SONY CORPORATION

Inventor： TAKAHIRO TAKEDA ,  YASUHIRO OKADA

IPC: H01P1/04 ,  H01P3/14 ,  H01P5/02 ,  H01P3/12

Abstract: The present technology relates to a connector for a waveguide, a communication module, a transmission cable, and an electronic device capable of reducing sizes of devices and parts using a plurality of waveguides. A connector for a waveguide is provided with an insertion unit in which a plurality of waveguides is inserted in a state in which side surfaces are opposed to each other, and a plurality of waveguide paths which connects a mounting surface which is a surface mounted on a substrate and the insertion unit and transmits signals transmitted by corresponding waveguides. The present technology is applicable to electronic devices which transmit signals using a plurality of waveguides, for example.

公开(公告)号：US20190013975A1

公开(公告)日：2019-01-10

申请号：US16065997

申请日：2017-01-04

Applicant: SONY CORPORATION

Inventor： KENICHI KAWASAKI ,  HIROYUKI YAMAGISHI ,  TAKAHIRO TAKEDA

IPC: H04L27/00 ,  H04B3/52 ,  H04Q1/24

CPC classification number: H04L27/0002 ,  H01P3/165 ,  H01Q13/06 ,  H04B1/40 ,  H04B3/52 ,  H04B17/17 ,  H04B17/29 ,  H04Q1/24

Abstract: The present technology relates to a transmitter, a transmission method, a receiver, and a reception method, and particularly to a transmitter, a transmission method, a receiver, and a reception method that can keep upsizing and cost increase to a minimum. The transmitter and the receiver have a detection mode and a communication mode as operation modes. The detection mode detects contact between a first waveguide on the side of the transmitter and a second waveguide on the side of the receiver. The communication mode sends or receives a modulated signal, acquired through frequency conversion of a baseband signal, via the first and second waveguides. The transmitter sends a given signal to the first waveguide in the detection mode. The transmitter and the receiver go from the detection mode to the communication mode in response to a given signal received by the receiver via the second waveguide and send and receive the modulated signal via the first and second waveguides in the communication mode. The present technology is applicable, for example, to communication via waveguides.