公开(公告)号：US10672724B2

公开(公告)日：2020-06-02

申请号：US16086708

申请日：2017-03-17

申请人： SONY CORPORATION

发明人： Yuichi Yamamoto

IPC分类号： H01L23/053 ,  H01L21/52 ,  H01L23/00 ,  H01L23/02 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L27/146 ,  H01L21/56 ,  H01L21/60

摘要： The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

公开(公告)号：US20130135543A1

公开(公告)日：2013-05-30

申请号：US13678608

申请日：2012-11-16

申请人： Sony Corporation

发明人： Keita Kaifu ,  Yuichi Yamamoto ,  Yasuyuki Seki ,  Yukiko Yamada

IPC分类号： G02F1/133

CPC分类号： G02F1/13306 ,  G02F1/13725 ,  H04N5/238

摘要： A liquid crystal dimmer includes: a liquid crystal dimming device adjusting a transmitted light amount of incident picked-up image light; a driving section supplying a drive voltage for driving the liquid crystal dimming device to the liquid crystal dimming device; and a control section controlling the drive voltage to control a dimmed state of the liquid crystal dimming device. The control section controls the drive voltage to allow plural-stage shifting of a tilt angle of a liquid crystal molecule in the liquid crystal dimming device when the liquid crystal dimming device is caused to undergo a state transition from one dimmed state to another dimmed state, the dimmed states being different from each other in the transmitted light amount.

摘要翻译： 液晶调光器包括：调节入射摄像图像光的透射光量的液晶调光装置; 驱动部，其向液晶调光装置供给驱动液晶调光装置的驱动电压; 以及控制部分，控制驱动电压以控制液晶调光装置的调光状态。 控制部分控制驱动电压以允许当使液晶调光装置经历从一个暗淡状态转变到另一个暗淡状态的状态时允许在液晶调光装置中液晶分子的倾斜角度的多级偏移， 调光状态在透射光量方面彼此不同。

公开(公告)号：US11024658B2

公开(公告)日：2021-06-01

申请号：US16807049

申请日：2020-03-02

申请人： SONY CORPORATION

发明人： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC分类号： H01L27/00 ,  H01L31/00 ,  H01L27/146 ,  H01L31/0203

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.
Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US11004806B2

公开(公告)日：2021-05-11

申请号：US16857110

申请日：2020-04-23

申请人： SONY CORPORATION

发明人： Yuichi Yamamoto

IPC分类号： H01L23/053 ,  H01L23/00 ,  H01L23/02 ,  H01L23/31 ,  H01L23/29 ,  H01L21/52 ,  H01L23/498 ,  H01L27/146 ,  H01L21/56 ,  H01L21/60

摘要： The present technology relates to a semiconductor device, a manufacturing method of a semiconductor device, an integrated substrate, and an electronic device capable of improving moisture resistance of the semiconductor device. The semiconductor device includes a semiconductor chip and a protective member which is a transparent member having moisture resistance and covers at least one of a first surface perpendicular to a side surface of the semiconductor chip or a second surface opposite to the first surface and the side surfaces. The electronic device includes the semiconductor device and the signal processing unit. The present technology is applied to, for example, an imaging element and an electronic device including an imaging element.

公开(公告)号：US10157957B2

公开(公告)日：2018-12-18

申请号：US15023832

申请日：2014-09-16

申请人： SONY CORPORATION

发明人： Yuichi Yamamoto ,  Kojiro Nagaoka

IPC分类号： H01L27/146 ,  H04N5/225 ,  G02B13/00

摘要： The present disclosure relates to a solid-state imaging element in which the cost reduction of a curved imaging element can be achieved, a method for manufacturing the solid-state imaging element, and an electronic apparatus. A curvature base is formed so as to be curved in a concave shape at a center leaving a small edge. The curvature base is divided into five portions of an element disposition portion and four peripheral portions. This element disposition portion is formed in a porous state. A pore (air bubble) in the porous state is smaller than a pixel size. A porous material such as a ceramic-based material, a metal-based material, or a resin-based material can be used as the porous material, for example. The present disclosure can be applied to a CMOS solid-state imaging element to be used for an imaging device, for example.

公开(公告)号：US10038021B2

公开(公告)日：2018-07-31

申请号：US15476629

申请日：2017-03-31

申请人： SONY CORPORATION

发明人： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/0203

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US09991301B2

公开(公告)日：2018-06-05

申请号：US15111003

申请日：2015-01-26

申请人： SONY CORPORATION

发明人： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC分类号： H01L27/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US11594563B2

公开(公告)日：2023-02-28

申请号：US17144947

申请日：2021-01-08

申请人： SONY CORPORATION

发明人： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC分类号： H01L27/146 ,  H01L31/0203

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.
Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US10608028B2

公开(公告)日：2020-03-31

申请号：US16045973

申请日：2018-07-26

申请人： SONY CORPORATION

发明人： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC分类号： H01L27/00 ,  H01L31/00 ,  H01L27/146 ,  H01L31/0203

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.