公开(公告)号：US20220293545A1

公开(公告)日：2022-09-15

申请号：US17626278

申请日：2020-07-01

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Kiyohisa SAKAI ,  Hirohisa YASUKAWA ,  Masayuki NAGAO

IPC: H01L23/00 ,  H01S5/024 ,  H01S5/02345

Abstract: A light emitting device includes a first substrate, a light source on a first surface of the first substrate and that emits light toward an object, and a driver disposed in the first substrate and that drives the light source. The driver overlaps the light source in a plan view. The light emitting device includes at least one first via disposed in the first substrate and overlapping the driver in the plan view, and a first conductor on a second surface of the first substrate opposite the first surface and overlapping the light source, the driver, and the at least one first via in the plan view. The first conductor is connected to the at least one first via.

公开(公告)号：US20220346288A1

公开(公告)日：2022-10-27

申请号：US17760932

申请日：2020-07-21

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Masayuki NAGAO ,  Hirohisa YASUKAWA

IPC: H05K9/00 ,  H01S5/042 ,  H01S5/024 ,  H01S5/0233 ,  H01S5/0235

Abstract: To reduce the wiring inductance when establishing electrical connection between a semiconductor laser and a laser driver in a semiconductor laser driving apparatus. A semiconductor laser driving apparatus includes a substrate, a laser driver, and a semiconductor laser. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A shield suppresses flow of electromagnetic waves to/from an outside of the semiconductor laser driving apparatus for at least one of the semiconductor laser and the laser driver.

公开(公告)号：US20220276344A1

公开(公告)日：2022-09-01

申请号：US17631970

申请日：2020-07-02

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hirohisa YASUKAWA ,  Masayuki NAGAO

IPC: G01S7/481 ,  G01S17/89

Abstract: A device includes a first substrate (903), a second substrate (100) on the first substrate (903), and a light emitting device (11) including a light source (300) on the second substrate (100) and that emits light toward an object. The light emitting device includes a driver (200) disposed in the second substrate (100) and that drives the light source (300). A portion of the driver (200) overlaps a first portion of the light source (300) in a plan view. The device includes an imaging device (12) on the first substrate adjacent to the light emitting device (11) and that senses light reflected from the object. The light-emitting device (11) reduces the wiring inductance by electrically connecting the light source (300) and the driver (200) via the connecting via (101). Further, the second substrate (100) includes a thermal via (102) for heat radiation. Considering that a certain number of thermal vias (102) are arranged immediately below the light source (300), the amount of overlap is desirably 50% or less. An upper surface surrounded by side wall (600) is covered by a diffuser plate (700). A light-receiving element (910) may be directly mounted as a bare chip on the substrate (903) by using an epoxy or silicone die attach material. The light source (300) preferably includes a semiconductor laser.