公开(公告)号：US20240154385A1

公开(公告)日：2024-05-09

申请号：US18414180

申请日：2024-01-16

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hirohisa YASUKAWA

IPC: H01S5/026 ,  H01S5/02345

CPC classification number: H01S5/0261 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0235

Abstract: In a semiconductor laser drive device, a wiring inductance in electrically connecting a semiconductor laser and a laser driver is reduced. The semiconductor laser drive device includes a substrate, the laser driver, and the semiconductor laser. The laser driver is built in the substrate. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser drive device. Connection wiring electrically connects the laser driver and the semiconductor laser by a wiring inductance of 0.5 nanohenries or less.

公开(公告)号：US20220294182A1

公开(公告)日：2022-09-15

申请号：US17626271

申请日：2020-06-08

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hirohisa YASUKAWA ,  Nobuaki KAJI

IPC: H01S5/02345 ,  H01S5/024 ,  H01S5/026

Abstract: An object of the present technique is to obtain excellent heat radiation characteristics with a simple structure in a semiconductor laser driving apparatus. A semiconductor laser driving apparatus includes a substrate, a laser driver, and a semiconductor laser. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. Side walls surround a region including the semiconductor laser on the surface of the substrate where the semiconductor laser is mounted. The side walls have a heat storage material therein.

公开(公告)号：US20210143607A1

公开(公告)日：2021-05-13

申请号：US17046836

申请日：2019-03-11

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Hirohisa YASUKAWA

IPC: H01S5/042 ,  H01S5/0235 ,  H01S5/0683

Abstract: In a semiconductor laser drive device, a wiring inductance in electrically connecting a semiconductor laser and a laser driver is reduced. The semiconductor laser drive device includes a substrate, the laser driver, and the semiconductor laser. The laser driver is built in the substrate. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser drive device. Connection wiring electrically connects the laser driver and the semiconductor laser by a wiring inductance of 0.5 nanohenries or less.

公开(公告)号：US20220302674A1

公开(公告)日：2022-09-22

申请号：US17638093

申请日：2020-08-12

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Kiyohisa SAKAI ,  Hirohisa YASUKAWA

IPC: H01S5/02345 ,  H01S5/026 ,  H01S5/02

Abstract: An object of the present technique is to easily downsize a semiconductor laser driving apparatus incorporating a laser driver. A semiconductor laser driving apparatus includes a substrate, a laser driver, a semiconductor laser, side walls, and a test pad. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser driving apparatus. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. The outer walls surround a predetermined mounting region that is included in the one surface of the substrate and where the semiconductor laser is mounted. The test pad is provided in a region that is included in the one surface of the substrate but does not correspond to the mounting region.

公开(公告)号：US20220285908A1

公开(公告)日：2022-09-08

申请号：US17641258

申请日：2020-07-20

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Nobuaki KAJI ,  Hirohisa YASUKAWA

IPC: H01S5/02345 ,  H01S5/026 ,  H01S5/00

Abstract: To reduce the wiring inductance between a semiconductor laser and a laser driver in a semiconductor laser driving apparatus. A substrate incorporates a laser driver. A semiconductor laser is mounted on one surface of the substrate of a semiconductor laser driving apparatus to emit irradiation light from an irradiation surface. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A temperature sensor measures a temperature relating to the semiconductor laser. A memory stores control data from the laser driver to the semiconductor laser in a manner corresponding to the temperature.

公开(公告)号：US20240194708A1

公开(公告)日：2024-06-13

申请号：US18554244

申请日：2021-12-28

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Mitsuru ADACHI ,  Toshihiro MURAYAMA ,  Ryo INOMOTO ,  Hirohisa YASUKAWA ,  Yuki SUDA ,  Masaki HATANO ,  Toshiki KOYAMA ,  Harumi MIYAKI ,  Kiyohisa SAKAI

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498

CPC classification number: H01L27/14618 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49827 ,  H01L24/32 ,  H01L27/14634 ,  H01L2224/32245

Abstract: Reliability is improved in a semiconductor device using a heat conductive member. The semiconductor device includes a first semiconductor chip, a heat dissipation member, a heat conductive member, and an outflow prevention part. In a semiconductor package including the first semiconductor chip, the heat dissipation member, the heat conductive member, and the outflow prevention part, the heat conductive member is disposed between the heat dissipation member and the chip plane of the first semiconductor chip. The outflow prevention part prevents the outflow of the heat conductive member from the chip plane of the first semiconductor chip.

公开(公告)号：US20220344897A1

公开(公告)日：2022-10-27

申请号：US17760741

申请日：2020-07-21

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Nobuaki KAJI ,  Tatsuya OIWA ,  Hirohisa YASUKAWA

IPC: H01S5/02345 ,  H01S5/02355

Abstract: In a semiconductor laser drive device, wiring inductance between a semiconductor laser and a laser driver is reduced. A substrate has a laser driver built inside. A semiconductor laser is mounted on one surface of a substrate of the semiconductor laser drive device and emits irradiation light from an irradiation surface. A connection wiring electrically connects the laser driver and the semiconductor laser with a wiring inductance of 0.5 nH or less. A passive component is disposed to face a side of the semiconductor laser having the least number of pads and connects to the semiconductor laser and the laser driver.

公开(公告)号：US20220293545A1

公开(公告)日：2022-09-15

申请号：US17626278

申请日：2020-07-01

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Kiyohisa SAKAI ,  Hirohisa YASUKAWA ,  Masayuki NAGAO

IPC: H01L23/00 ,  H01S5/024 ,  H01S5/02345

Abstract: A light emitting device includes a first substrate, a light source on a first surface of the first substrate and that emits light toward an object, and a driver disposed in the first substrate and that drives the light source. The driver overlaps the light source in a plan view. The light emitting device includes at least one first via disposed in the first substrate and overlapping the driver in the plan view, and a first conductor on a second surface of the first substrate opposite the first surface and overlapping the light source, the driver, and the at least one first via in the plan view. The first conductor is connected to the at least one first via.

公开(公告)号：US20220346288A1

公开(公告)日：2022-10-27

申请号：US17760932

申请日：2020-07-21

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Masayuki NAGAO ,  Hirohisa YASUKAWA

IPC: H05K9/00 ,  H01S5/042 ,  H01S5/024 ,  H01S5/0233 ,  H01S5/0235

Abstract: To reduce the wiring inductance when establishing electrical connection between a semiconductor laser and a laser driver in a semiconductor laser driving apparatus. A semiconductor laser driving apparatus includes a substrate, a laser driver, and a semiconductor laser. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A shield suppresses flow of electromagnetic waves to/from an outside of the semiconductor laser driving apparatus for at least one of the semiconductor laser and the laser driver.

公开(公告)号：US20220294181A1

公开(公告)日：2022-09-15

申请号：US17641281

申请日：2020-07-20

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Nobuaki KAJI ,  Hirohisa YASUKAWA

IPC: H01S5/02253 ,  H01S5/026

Abstract: To reduce the wiring inductance between a semiconductor laser and a laser driver in a semiconductor laser driving apparatus. A substrate incorporates a laser driver. A semiconductor laser is mounted on one surface of the substrate of a semiconductor laser driving apparatus to emit irradiation light from an irradiation surface. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. A first optical element is provided on the irradiation surface side of the semiconductor laser. A second optical element is provided outside the first optical element on the irradiation surface side of the semiconductor laser.