公开(公告)号：US20230343732A1

公开(公告)日：2023-10-26

申请号：US18343606

申请日：2023-06-28

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Choon Heung Lee ,  JunHo Ye

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/565 ,  H01Q1/2283 ,  H01L23/552 ,  H01L2223/6677

Abstract: A semiconductor device has an electrical component assembly, and a plurality of discrete antenna modules disposed over the electrical component assembly. Each discrete antenna module is capable of providing RF communication for the electrical component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electrical components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electrical component assembly.

公开(公告)号：US12211808B2

公开(公告)日：2025-01-28

申请号：US18343606

申请日：2023-06-28

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Choon Heung Lee ,  JunHo Ye

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01Q1/22

Abstract: A semiconductor device has an electrical component assembly, and a plurality of discrete antenna modules disposed over the electrical component assembly. Each discrete antenna module is capable of providing RF communication for the electrical component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electrical components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electrical component assembly.

公开(公告)号：US11735539B2

公开(公告)日：2023-08-22

申请号：US17092449

申请日：2020-11-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Choon Heung Lee ,  JunHo Ye

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/5386 ,  H01L23/552 ,  H01Q1/2283 ,  H01L2223/6677

Abstract: A semiconductor device has an electronic component assembly, and a plurality of discrete antenna modules disposed over the electronic component assembly. Each discrete antenna module is capable of providing RF communication for the electronic component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electronic components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electronic component assembly.

公开(公告)号：US20220148983A1

公开(公告)日：2022-05-12

申请号：US17092449

申请日：2020-11-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  Choon Heung Lee ,  JunHo Ye

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22

Abstract: A semiconductor device has an electronic component assembly, and a plurality of discrete antenna modules disposed over the electronic component assembly. Each discrete antenna module is capable of providing RF communication for the electronic component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electronic components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electronic component assembly.