公开(公告)号：US20240234291A1

公开(公告)日：2024-07-11

申请号：US18150567

申请日：2023-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HyunSeok Park ,  KyoWang Koo ,  Sinjae Kim

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/16

CPC classification number: H01L23/49877 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L25/16 ,  H01L24/16

Abstract: A semiconductor device has a one-layer interconnect substrate and electrical component disposed over a first surface of the interconnect substrate. The electrical components can be discrete electrical devices, IPDs, semiconductor die, semiconductor packages, surface mount devices, and RF components. An RDL with a graphene core shell is formed over a second surface of the interconnect substrate. The graphene core shell has a copper core and a graphene coating formed over the copper core. The RDL further has a matrix to embed the graphene core shell. The graphene core shells through RDL form an electrical path. The RDL can be thermoset material or polymer or composite epoxy type matrix. The graphene core shell is embedded within the thermoset material or polymer or composite epoxy type matrix. The RDL with graphene core shell is useful for electrical conductivity and electrical interconnect within an SIP.

公开(公告)号：US20240096736A1

公开(公告)日：2024-03-21

申请号：US17932987

申请日：2022-09-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HeeSoo Lee ,  HyunSeok Park

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L25/16

CPC classification number: H01L23/3733 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3737 ,  H01L25/165 ,  H01L24/16

Abstract: A semiconductor device has a substrate and electrical component disposed over the substrate. The electrical component can be a semiconductor die, semiconductor package, surface mount device, RF component, discrete electrical device, or IPD. A TIM is deposited over the electrical component. The TIM has a core, such as Cu, covered by graphene. A heat sink is disposed over the TIM, electrical component, and substrate. The TIM is printed on the electrical component. The graphene is interconnected within the TIM to form a thermal path from a first surface of the TIM to a second surface of the TIM opposite the first surface of the TIM. The TIM has thermoset material or soldering type matrix and the core covered by graphene is embedded within the thermoset material or soldering type matrix. A metal layer can be formed between the TIM and electrical component.