公开(公告)号：US20230402399A1

公开(公告)日：2023-12-14

申请号：US18329605

申请日：2023-06-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SeungHyun LEE ,  KyungHwan KIM ,  HongKyu PARK ,  InHo SEO ,  MyungGyu JIN

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/36

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L21/56 ,  H01L23/36

Abstract: A semiconductor device comprises a substrate, at least one electronic component mounted on the substrate, an encapsulant formed on the substrate and at least partially encapsulating the at least one electronic component, a shielding layer formed on the encapsulant, a thermal interface layer formed on the shielding layer, and a metal lid formed on the thermal interface layer.