公开(公告)号：US20250112078A1

公开(公告)日：2025-04-03

申请号：US18479276

申请日：2023-10-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Tack Chee Yong ,  Yi Jing Eric Chong ,  Kok Lim Jason Ng ,  Linda Pei Ee Chua

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68

Abstract: A semiconductor manufacturing equipment has a wafer tape including a plurality of alignment holes formed through the wafer tape. A semiconductor wafer is disposed over the wafer tape. The semiconductor wafer includes a circular or rectangular form-factor. A light source is disposed under the wafer tape. The semiconductor wafer is misaligned on the wafer tape with light passing through one or more alignment holes. The semiconductor wafer is centered on the wafer tape with no light passing through one or more alignment holes. The wafer tape has a plurality of wafer alignment markings for different size semiconductor wafers. A light detector is disposed over the semiconductor wafer to detect light passing through the wafer tape. A control arm can be attached to the semiconductor wafer to provide the ability to move the semiconductor wafer in response to a control signal from the light detector.