公开(公告)号：US20230326769A1

公开(公告)日：2023-10-12

申请号：US18184670

申请日：2023-03-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyoWang KOO ,  SeoJun BAE ,  JungSub LEE

IPC: H01L21/56 ,  H01L25/00

CPC classification number: H01L21/565 ,  H01L25/50

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a top surface and a bottom surface; a top electronic component mounted on the top surface of the substrate; at least one conductive pillar formed on the bottom surface of the substrate; and a protection layer attached on the bottom surface of the substrate and covering the at least one conductive pillar; providing a molding apparatus including a top chase and a bottom chase, wherein a molding material is held in the bottom chase; attaching the protection layer onto the top chase of the molding apparatus; and moving the top chase and the bottom chase close to each other to compress the molding material to cover the top electronic component on the top surface of the substrate, thereby forming a top encapsulation on the top surface of the substrate.