公开(公告)号：US20230369165A1

公开(公告)日：2023-11-16

申请号：US18315496

申请日：2023-05-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooHan PARK ,  KyungEun KIM ,  YoSep PARK ,  InWeon RA

IPC: H01L23/40 ,  H01L23/495 ,  H01L23/13 ,  H01L21/60

CPC classification number: H01L23/40 ,  H01L23/49562 ,  H01L23/13 ,  H01L21/60

Abstract: A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.