公开(公告)号：US20230411263A1

公开(公告)日：2023-12-21

申请号：US18332777

申请日：2023-06-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooHan PARK ,  KyungEun KIM ,  YouJin SHIN ,  HyeSun KIM

IPC: H01L23/498 ,  H01L25/16 ,  H01L25/03 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/49827 ,  H01L25/16 ,  H01L25/03 ,  H01L21/568 ,  H01L21/561 ,  H01L24/24 ,  H01L24/96 ,  H01L24/82 ,  H01L25/50 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/5385 ,  H01L2224/96 ,  H01L2224/24155 ,  H01L2224/24101 ,  H01L2224/82105 ,  H01L2224/2402 ,  H01L2224/82005

Abstract: A modular semiconductor device comprises: an encapsulant layer with an encapsulant bottom surface and an encapsulant top surface, wherein the encapsulant layer comprises a component region and an interlayer connection region; wherein the semiconductor component comprises a component conductive pattern exposed from the encapsulant bottom surface; an interlayer connection array disposed within the interlayer connection region, wherein the interlayer connection array comprises one or more conductive vias each extending between the encapsulant bottom surface and the encapsulant top surface; and an interposer layer laminated on the encapsulant layer and having an interposer bottom surface and an interposer top surface, wherein the interposer top surface is in contact with the encapsulant bottom surface; wherein the interposer layer comprises an interposer conductive pattern on the interposer bottom surface, and an interposer interconnection structure electrically coupled to the component conductive pattern, the interposer conductive pattern and the one or more conductive vias.

公开(公告)号：US20230402344A1

公开(公告)日：2023-12-14

申请号：US18330347

申请日：2023-06-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooHan PARK ,  HyeSun KIM ,  KyungEun KIM ,  YouJin SHIN

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/50

CPC classification number: H01L23/3675 ,  H01L24/32 ,  H01L21/50 ,  H01L2224/32245

Abstract: Provided is a heat spreader for use with a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate. The heat spreader comprises: a main body defining a space for receiving the at least one semiconductor die; and two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other. When the heat spreader is mounted with the semiconductor device, the slots prevent the substrate from moving closer to or away from the main body.

公开(公告)号：US20230369165A1

公开(公告)日：2023-11-16

申请号：US18315496

申请日：2023-05-10

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： SooHan PARK ,  KyungEun KIM ,  YoSep PARK ,  InWeon RA

IPC: H01L23/40 ,  H01L23/495 ,  H01L23/13 ,  H01L21/60

CPC classification number: H01L23/40 ,  H01L23/49562 ,  H01L23/13 ,  H01L21/60

Abstract: A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.