公开(公告)号：US20230170245A1

公开(公告)日：2023-06-01

申请号：US17457074

申请日：2021-12-01

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  DaePark Lee ,  YoungKang Lee ,  YongJin Jeong

IPC: H01L21/683 ,  H01L23/552 ,  H01L21/48

CPC classification number: H01L21/6836 ,  H01L23/552 ,  H01L21/4814

Abstract: A semiconductor device is formed using a jig. The jig includes a metal frame, a polymer film, and an adhesive layer disposed between the metal frame and polymer film. An opening is formed through the adhesive layer and polymer film. A groove is formed around the opening. A semiconductor package is disposed on the jig over the opening with a side surface of the semiconductor package adjacent to the groove. A shielding layer is formed over the semiconductor package and jig. The semiconductor package is removed from the jig.