公开(公告)号：US20220157739A1

公开(公告)日：2022-05-19

申请号：US16950295

申请日：2020-11-17

申请人： STATS ChipPAC Pte. Ltd.

发明人： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L21/56

摘要： A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US10418341B2

公开(公告)日：2019-09-17

申请号：US15686584

申请日：2017-08-25

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  OhHan Kim ,  InSang Yoon

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

摘要： A semiconductor device has a carrier with an adhesive layer formed over the carrier. Alignment marks are provided for picking and placing the electrical component on the carrier or adhesive layer. An electrical component is disposed on the adhesive layer by pressing terminals of the electrical component into the adhesive layer. The electrical component can be a semiconductor die, discrete component, electronic module, and semiconductor package. A leadframe is disposed over the adhesive layer. A shielding layer is formed over the electrical component. An encapsulant is deposited over the electrical component. The carrier and adhesive layer are removed so that the terminals of the electrical component extend out from the encapsulant for electrical interconnect. A substrate includes a plurality of conductive traces. The semiconductor device is disposed on the substrate with the terminals of the electrical component in contact with the conductive traces.

公开(公告)号：US11990424B2

公开(公告)日：2024-05-21

申请号：US18303308

申请日：2023-04-19

申请人： STATS ChipPAC Pte. Ltd.

发明人： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

摘要： A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20230361103A1

公开(公告)日：2023-11-09

申请号：US18355906

申请日：2023-07-20

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  JinHee Jung

IPC分类号： H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L25/065 ,  H01L23/552

CPC分类号： H01L25/50 ,  H01L21/78 ,  H01L21/56 ,  H01L25/0652 ,  H01L23/552 ,  H01L2225/06524

摘要： A semiconductor device is formed by providing a semiconductor package including a shielding layer and forming a slot in the shielding layer using a laser. The laser is turned on and exposed to the shielding layer with a center of the laser disposed over a first point of the shielding layer. The laser is moved in a loop while the laser remains on and exposed to the shielding layer. Exposure of the laser to the shielding layer is stopped when the center of the laser is disposed over a second point of the shielding layer. A distance between the first point and the second point is approximately equal to a radius of the laser.

公开(公告)号：US20230275034A1

公开(公告)日：2023-08-31

申请号：US18303308

申请日：2023-04-19

申请人： STATS ChipPAC Pte. Ltd.

发明人： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

摘要： A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20230215812A1

公开(公告)日：2023-07-06

申请号：US17647055

申请日：2022-01-05

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  ChangOh Kim ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/78

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/78

摘要： A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.

公开(公告)号：US20230170311A1

公开(公告)日：2023-06-01

申请号：US18161693

申请日：2023-01-30

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01Q1/22 ,  H01L21/56 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/486 ,  H01Q1/2283 ,  H01L21/56 ,  H01L23/66

摘要： A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20220199423A1

公开(公告)日：2022-06-23

申请号：US17127079

申请日：2020-12-18

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L23/552 ,  H01L21/683

摘要： A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US20180061806A1

公开(公告)日：2018-03-01

申请号：US15686584

申请日：2017-08-25

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  OhHan Kim ,  InSang Yoon

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

CPC分类号： H01L24/96 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/95001 ,  H01L2224/95136 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A semiconductor device has a carrier with an adhesive layer formed over the carrier. Alignment marks are provided for picking and placing the electrical component on the carrier or adhesive layer. An electrical component is disposed on the adhesive layer by pressing terminals of the electrical component into the adhesive layer. The electrical component can be a semiconductor die, discrete component, electronic module, and semiconductor package. A leadframe is disposed over the adhesive layer. A shielding layer is formed over the electrical component. An encapsulant is deposited over the electrical component. The carrier and adhesive layer are removed so that the terminals of the electrical component extend out from the encapsulant for electrical interconnect. A substrate includes a plurality of conductive traces. The semiconductor device is disposed on the substrate with the terminals of the electrical component in contact with the conductive traces.

公开(公告)号：US20240162103A1

公开(公告)日：2024-05-16

申请号：US18422759

申请日：2024-01-25

申请人： STATS ChipPAC Pte. Ltd.

发明人： JinHee Jung ,  ChangOh Kim

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/60 ,  H01L23/66

CPC分类号： H01L23/31 ,  H01L21/565 ,  H01L23/60 ,  H01L23/66

摘要： A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed over the molding compound sheet. The carrier is pressed against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant. A shielding layer can be formed over the electrical components assembly. The carrier is removed to expose the first electrical circuit pattern. A second encapsulant is deposited over the first encapsulant and the first electrical circuit pattern. A second electrical circuit pattern is formed over the second encapsulant. A semiconductor package is disposed over the first electrical circuit pattern.