公开(公告)号：US20230059627A1

公开(公告)日：2023-02-23

申请号：US17885201

申请日：2022-08-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Justin CATANIA ,  Michel GARNIER ,  Fabien QUERCIA

IPC: H01L23/13 ,  H05K1/18 ,  H05K3/34 ,  H05K3/30

Abstract: The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).